RF-35tc Dk of 3.5 Double-Sided 5mil PCB: High-Frequency Board with Gold Plated for High-Power RF Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-35tc
• Model NO.: BIC-1224-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RF-35TC Double-Sided 0.2mm PCB: High-Frequency Board with 4/5 Mils Trace/Space for High-Power RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Overview of This PCB
Engineered for demanding high-power RF and microwave systems, this ultra-thin double-sided PCB features Rogers RF-35TC laminate to deliver exceptional thermal management and signal integrity. Optimized for 5G infrastructure, satellite communications, and radar systems, it combines best-in-class thermal conductivity (0.92 W/m/K) with ultra-low loss characteristics (Df=0.002 @10GHz). Certified to IPC-Class 2 standards, this PCB ensures reliable performance in high-power and extreme thermal environments.



Key Benefits Include:
1. Superior Thermal Management: 0.92 W/m/K conductivity prevents hot spots in power amplifiers
2. Ultra-Low Signal Loss: Dk=3.5±0.05 with exceptional stability across temperatures
3. Military-Grade Reliability: Decomposition temperature of 436°C
4. Manufacturing Efficiency: Processes like FR-4 but with PTFE-level performance


2. PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	Rogers RF-35TC
Layer Count	2-layer
Board Dimensions	48.17mm x 47.7mm (±0.15mm)
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.3mm
Finished Thickness	0.2mm
Copper Weight	1oz (35μm)
Via Plating Thickness	20μm
Surface Finish	Immersion Gold (ENIG)
Top Silkscreen	White
Solder Mask	None
Electrical Testing	100% tested (IPC-Class 2)

Stackup Configuration:

Top Layer: 35μm Cu + ENIG

Core: 0.127mm RF-35TC

Bottom Layer: 35μm Cu + ENIG


3. Performance Features & Applications
Material Advantages:

CTE Matched to Copper (11/13/34 ppm/°C) prevents delamination

Moisture Resistant (0.05% absorption) for humid environments

Flame Retardant: UL 94 V-0 compliant

High-Frequency Optimized: Stable up to 40GHz



Design Specifications:

Components: 18 (12 SMT, 21 thru-hole)
Pads: 33 total
Vias: 24
Nets: 2
Artwork: Gerber RS-274X


Typical Applications:

5G mmWave: Power amplifiers and base station antennas

Satellite Comms: High-power transceivers and LNBs

Defense Systems: Radar and EW equipment

Automotive Radar: 77GHz ADAS modules


Why Choose This PCB?
1. Unmatched Thermal Performance for power-dense designs
2. Precision 4/5 mils Trace/Space for high-density RF layouts
3. Ultra-Thin 0.2mm Profile for space-constrained applications
4. Proven Reliability: 1000 thermal cycles (-55°C to +125°C)



RF-35TC PCB, 0.2mm Ultra-Thin PCB, High-Power RF Board, 4/5 Mils Trace Space, ENIG Finish, Thermal Management PCB, 5G Amplifier Circuit, IPC-Class 2 Compliant


Order Now for High-Power RF Solutions!
Contact us to customize your design or request samples. Our engineering team specializes in high-frequency thermal management challenges.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.