Rogers RT/duroid 6035HTC 2-Layer 0.83mm Thickness PCB for High Power RF & Microwave Amplifiers
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of This Type of PCB
This 2-layer PCB, constructed with RT/duroid 6035HTC laminate as the base material, is specifically designed for high power RF and microwave applications. Its robust build and precise specifications make it a reliable choice in scenarios where efficient heat dissipation and stable high-frequency performance are essential, such as in power amplifiers and couplers. Adhering to the IPC-Class-2 standard, Rogers RT/duroid 6035HTC PCB ensures consistent quality and compatibility with demanding electronic systems, providing a solid foundation for high-power electronic setups.
2. PCB Construction Details
| Parameter |
Specifications |
| Base material |
RT/duroid 6035HTC |
| Layer count |
2 Layers |
| Board dimensions |
49.23mm x 55.55mm = 1PCS, +/- 0.15mm |
| Minimum Trace/Space |
6/5 mils |
| Minimum Hole Size |
0.6mm |
| Blind vias |
None |
| Finished board thickness |
0.83mm |
| Finished Cu weight |
1oz (1.4 mils) outer layers |
| Via plating thickness |
20 μm |
| Surface finish |
Immersion Gold |
| Top Silkscreen |
White |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Blue |
| Bottom Solder Mask |
No |
| Quality Assurance |
100% Electrical test used prior to shipment |
- Additional Components & Features
- PCB Stackup: The 2-layer rigid PCB features a well-balanced structure: Copper_layer_1 (35 μm) + RT/duroid 6035HTC (0.762 mm (30mil)) + Copper_layer_2 (35 μm), which contributes to its stable performance and efficient heat conduction.
- Availability: Shipped worldwide, with artwork supplied in Gerber RS-274-X format to ensure seamless integration into various production workflows.
Material Advantages:
Rogers RT/duroid 6035HTC PCB is a ceramic filled PTFE composite, ideal for high power RF and microwave applications. It boasts a thermal conductivity of 1.44 W/m/K at 80°C, almost 2.4 times that of standard RT/duroid 6000 products, enabling excellent heat dissipation. The RT/duroid 6035HTC PCB material also offers a DK of 3.5 +/- 0.05 at 10 GHz/23°C and a low dissipation factor of 0.0013 at 10 GHz/23°C, ensuring high-frequency performance. Additionally, its advanced filler system provides excellent drill-ability, reducing drilling costs compared to standard high thermally conductive laminates using alumina fillers.
- PCB Statistics: Equipped with 35 components, 112 total pads (including 74 thru hole pads and 38 top SMT pads), 64 vias, and 2 nets, RT/duroid 6035HTC PCB is designed to meet the complex needs of high-power electronic devices.
- Typical Applications: Perfect for high power RF and microwave amplifiers, as well as power amplifiers, couplers, filters, combiners, and power dividers.
Why Choose This PCB?
RT/duroid 6035HTC PCB combines the superior thermal conductivity and high-frequency performance of 0.83mm RT/duroid 6035HTC PCB with precise manufacturing, from 0.6mm minimum holes to 20μm via plating. The 100% electrical test prior to shipment ensures reliable performance, while the 2-layer design balances functionality and efficiency, making it an excellent choice for high-power RF and microwave applications.
Tags:RT/duroid 6035HTC PCB, 2-layer PCB, 0.83mm thickness PCB, high power RF PCB, microwave amplifier PCB, Immersion Gold surface finish PCB, IPC-Class-2 PCB, Gerber RS-274-X PCB, blue solder mask PCB, worldwide shipped PCB
Order Now for High Power RF & Microwave Excellence!
Upgrade your high-power electronic systems with this high-performance PCB-order today to enhance the efficiency and reliability of your RF and microwave amplifiers.
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