Tlx-9 Ultra-Thin 0.3mm 10mil PCB: High-Frequency Board with Via Plating for Telecom Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tlx-9
• Model NO.: BIC-1235-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

TLX-9 Ultra-Thin 0.3mm PCB: High-Frequency Board with 5/6 Mils Trace/Space for Telecom Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)



1. Product Overview
This precision 2-layer PCB utilizes Taconic TLX-9 PTFE composite, delivering exceptional RF performance for demanding telecommunications and satellite applications.

Key features include:
1. Ultra-Low Loss: Dk=2.5 with Df=0.0019 @10GHz
2. Space-Saving Design: 0.3mm thin profile
3. High Reliability: 12 lbs/in peel strength and V-0 flammability
4. Environmental Resistance: <0.02% moisture absorption

Certified to IPC-Class 2 standards, this PCB is ideal for LNB, PCS/PCN, and high-power RF systems.



2. Technical Specifications

Parameter	Specification
Material	TLX-9
Dimensions	33.5×63.2mm (±0.15mm)
Thickness	0.3mm (10mil core)
Copper	1oz (35μm)
Trace/Space	5/6 mils
Holes	0.3mm (20μm plating)
Surface Finish	ENIG
Dielectric Strength	>60kV
Flexural Strength	>23,000 lbs/in

Stackup Configuration:
Layer 1: 35μm Copper

Core: 0.254mm TLX-9

Layer 2: 35μm Copper



3. Key Advantages & Applications
Material Superiority
High Purity: >10⁷ Mohm/cm volume resistivity

Thermal Stability: 9-12ppm/°C in-plane CTE

Mechanical Durability: Withstands harsh environments


Design Specifications

Components: 14 (9 SMT, 17 thru-hole)
Vias: 21 (high-density interconnects)
Nets: 2
Artwork: Gerber RS-274X



Target Applications

Satellite Comms: LNB/LNA modules

5G Infrastructure: PCS/PCN antennas

RF Power Systems: High-power amplifiers

Test Equipment: Precision microwave devices


Why TLX-9?
1. 5/6 Mils Precision: Supports complex RF layouts
2. ENIG Finish: Optimal for high-frequency components
3. Space-Qualified: Low outgassing potential
4. Global Availability: Prototype to production


Key Differentiators:

60kV dielectric strength for high-voltage applications

0.19 W/m/K thermal conductivity for heat dissipation

>180 sec arc resistance for reliability

V-0 flammability rating for safety compliance


Thank you for your reading and you're welcome to contact us for your PCB enquiries.