Tmm10I Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-153-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 15mil 25mil 50mil 75mil
• Layer Count: Double Layer, Multilayer, Hybrid PCB
• Application: Stripline and Microstrip
• Surface Finish: HASL, Enig, Immersion Tin, Immersion Silver, OSP
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

15mil 25mil 50mil 75mil TMM10i Printed Circuit Board of Shenzhen Bicheng Electronics PCB design
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Rogers' TMM10i thermoset microwave materials, being ceramic, hydrocarbon, and thermoset polymer composites, are engineered for high-reliability stripline and microstrip applications with plated-thru-holes.


In terms of electrical and mechanical features, TMM10i laminates combine numerous advantages of ceramic and traditional PTFE microwave circuit laminates. Notably, it doesn't call for the specialized production techniques typical of these materials.


TMM10i laminates have an extremely low thermal coefficient of dielectric constant, usually not exceeding 30 ppm/°C. Their isotropic coefficients of thermal expansion, which are well-matched with copper, enable the production of high-reliability plated through holes and low etch shrinkage. Furthermore, the thermal conductivity of TMM10i laminates is about twice that of traditional PTFE/ceramic laminates, which helps in heat dissipation.

As TMM10i laminates are made from thermoset resins and don't soften upon heating, wire bonding of component leads to circuit traces can be carried out without the worry of pad lifting or substrate deformation.
 

Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems


Our PCB Capabilities (TMM10i)  

PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10i
Dielectric constant:	9.80 ±0.245
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

Data Sheet of TMM10i   

TMM10i Typical Value
Property		TMM10i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.80±0.245	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.9	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-43	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		267	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.8	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.13
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.72	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-