General Profile
High frequency printed circuit board or microwave PCB refers to the printed circuit board made on the high frequency (microwave) substrate copper clad plate. The common types are: Double-sided board, multilayer board and mixed structure. Mixed structure includes high performance special substrate, PP sheet + ordinary performance board and PP sheet mixed pressing board; high frequency substrate + ordinary FR4 substrate; high frequency substrate + metal base etc.
Advantages
1) Reducing signal loss in high frequency application meets the development needs of communication technology;
2) Excellent high frequency performance due to low dielectric tolerance and loss;
3) Stable electrical coefficient of dielectric constant;
4) Excellent dimensional stability;
5) Good high temperature and low temperature resistance(-192ºC-260ºC);
6) Superior corrosion resistance;
7) No corrosion in acids, alkali and aqua regia;
Applications
* Current mobile: 0.9GHz - 2GHz
* 3G systems: 2.5GHz
* Bluetooth: 2.5GHz
* GPS: 12.6GHz
* LMDS: 24GHz and 40GHz
* Automotive: 77GHz
Market: RFID, Wireless communications, base station and antenna, amplifier, military products, consumer electronics.
Design For Manufacturability
This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products. This DFM is divided into 6 parts for our readers. This is the section IV.
| Serial NO. |
Procedure |
Item |
Manufacturing capability |
| Large volume (S<100 m²) |
Middle volume (S<10 m²) |
Prototype(S<1m²) |
|
| 48 |
Silkscreen |
Min.width of silkscreen text |
6mil |
6mil |
5mil |
| 49 |
Min.height of silkscreen text |
35mil |
35mil |
30mil |
| 50 |
Min.space from silkscreen to pads |
6mil |
6mil |
5mil |
| 51 |
Colour of silkscreen |
White, Black, Yellow |
| 52 |
Carbon ink |
Carbon ink covers conductor or pads |
14mil |
13mil |
12mil |
| 53 |
Mid distance from carbon ink to pads |
12mil |
11mil |
10mil |
| 54 |
Peelable mask |
Peelable mask covers conductor or pads |
8mil |
7mil |
6mil |
| 55 |
Min.distance from peelable mask to pads |
14mil |
13mil |
12mil |
| 56 |
Max.via-plug of Silk-screen method |
2.0mm |
2.0mm |
2.0mm |
| 57 |
Max. via-plug of aluminum foil method |
4.5mm |
4.5mm |
4.5mm |
| 58 |
Surface finish |
Thickness of nickel of ENIG |
3-5um |
3-5um |
2-6.35um |
| 59 |
Thickness of Gold of ENIG |
0.05-0.1um |
| 60 |
Thickness of nickel of Gold finger |
3-5um |
| 61 |
Thickness of Gold of Gold finger |
0.1-1.27um |
| 62 |
Thickness of tin of HASL |
2.54-6.35um |
| 63 |
Thickness of OSP |
0.2-0.5um |
| 64 |
Thickness of tin of Immersion tin |
0.2-0.75um |
| 65 |
Thickness of silver of Immersion silver |
0.15-0.75um |
Audited Supplier 
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