| Customization: | Available |
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| Type: | Rigid-Flexible PCB |
| Dielectric: | Panasonic R-F777 Polyimide (50 µm) |
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(FPC's are custom-made products, the picture and parameters shown are just for reference)
In the world of advanced electronics, the 12-Layer Flex-Rigid PCB is a cutting-edge solution designed for high-performance applications requiring both flexibility and rigidity. Built with Panasonic R-F777 Polyimide for flexible layers and Tg170ºC FR4 for rigid layers, this PCB offers exceptional thermal stability, mechanical strength, and signal integrity. With immersion gold surface finish and high-precision impedance control, it is ideal for portable WiFi routers, industrial equipment, automotive electronics, and 5G communication systems.
Key Features of 12-Layer Flex-Rigid PCB
1.High Thermal Stability: The use of Tg170ºC FR4 and non-flowing 1080 Prepreg ensures excellent heat resistance, making the PCB suitable for high-temperature environments and lead-free soldering processes.
2.High Thermal Stability: The use of Tg170ºC FR4 and non-flowing 1080 Prepreg ensures excellent heat resistance, making the PCB suitable for high-temperature environments and lead-free soldering processes.
3.High-Precision Impedance Control: The PCB features optimized impedance control with a tolerance of ±10%, ensuring stable signal transmission for high-speed applications.
4.Advanced Microvia Design: 0.2mm vias are resin-filled and capped, enhancing interconnection reliability and preventing soldering short circuits.
5.High Reliability: Manufactured to IPC-6013 Class 3 standards, the PCB undergoes rigorous testing, including thermal stress testing (288ºC, 10s, 3 times) and flexible layer bending cycle testing (>10,000 cycles without cracking).
6.Customizable Design: The PCB supports customized impedance, materials, and panel solutions, ensuring it meets the specific needs of your application.
Data sheet
| Size of Flex-rigid PCB | 110 X 51mm=1PCS |
| Number of Layers | 12-Layer |
| Board Type | Flexible Rigid PCB |
| Board Thickness | 1.6mm |
| Board Material | 1.6mm FR-4 / Polyimide 50µm |
| Board Material Supplier | Shengyi / Panasonic |
| Tg Value of Board Material | 170ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 18 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow coverlay / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | n/a |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| Impedance control | Single-Ended 50Ω, 8mil Layer 4 |
| Via design | 0.2mm via filled and capped |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
The 12-Layer Flex-Rigid PCB is well-suited for a variety of high-performance applications, including:
Portable WiFi Routers: Ensures reliable performance in compact and flexible designs.
High-End Industrial Equipment: Ideal for robot control modules and high-precision sensors.
Automotive Electronics: Suitable for onboard cameras and ADAS (Advanced Driver Assistance Systems).
Medical and Aerospace: Perfect for portable medical devices and airborne high-density electronic systems.
5G Communication: Ensures stable signal transmission in base station radio frequency modules and millimeter-wave high-frequency applications.
Why Choose 12-Layer Flex-Rigid PCB?
1.Superior Thermal and Mechanical Performance: The combination of Tg170ºC FR4 and Panasonic R-F777 Polyimide ensures the PCB can withstand high temperatures and mechanical stress.
2.High Signal Integrity: Advanced impedance control and simulation modeling ensure efficient and stable signal transmission.
3.Reliability: Rigorous testing and IPC-6013 Class 3 certification guarantee the highest level of reliability for flex-rigid boards.
4.Fast Delivery: Prototype cycles are as short as 15 days, with flexible production scheduling for bulk orders.
5.Technical Support: We provide stack-up structure simulation files (Gerber + IPC-2581) and DFM (Design for Manufacturing) reports to ensure optimal performance.
Advanced Process and Reliability
Microvia Design: 0.2mm vias are resin-filled and capped, ensuring reliable interconnections and preventing soldering defects.
Thermal Stability: The high Tg materials (Tg≥170ºC) support lead-free soldering and high-temperature applications.
Testing: The PCB undergoes thermal stress testing (288ºC, 10s, 3 times), bending cycle testing (>10,000 cycles), and 4-wire low resistance testing (100% coverage of open and short circuits).
Conclusion
The 12-Layer Flex-Rigid PCB is a high-performance, reliable solution designed for applications requiring both flexibility and rigidity. With its advanced materials, precise impedance control, and rigorous testing, it is an ideal choice for engineers working on portable WiFi routers, industrial equipment, automotive electronics, and 5G communication systems.
Whether you're designing for high-speed signal transmission or demanding thermal environments, the 12-Layer Flex-Rigid PCB offers the reliability and performance you need to bring your projects to life.
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