| Customization: | Available |
|---|---|
| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
| Payment Methods: |
|
|---|---|
| Support payments in USD |
| Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
|---|
| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
|---|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
Introducing our Adhesiveless Flexible Printed Circuit (FPC), constructed from SF202 polyimide material, measuring 85 x 37 mm. This double-sided FPC is designed to meet the rigorous demands of modern electronics while offering exceptional durability and flexibility.
The layer stack-up features copper layers of 35 micrometers (1 oz) on both sides, ensuring optimal electrical conductivity. The design allows for a minimum trace and space requirement of 20 mil, facilitating precise and efficient signal routing.
This flexible circuit accommodates hole diameters ranging from 0.3 mm to 1.0 mm, with a final external foil thickness of 1 oz and a slim profile of just 0.15 mm (±0.05 mm). The immersion gold surface finish enhances solderability and provides excellent oxidation protection, ensuring reliable performance in various applications.
FPC Specifications:
| PCB SIZE | 85 x 37mm=1PCS |
| Base Material: | Polyimide |
| Number of Layers | Double sided PCB |
| SMT | SMT |
| Through Hole Components | no |
| LAYER STACKUP | Copper ------- 35um(1oz) |
| Polyimide | |
| Copper ------- 35um(1oz) | |
| Minimum Trace and Space: | 20mil/20mil |
| Minimum / Maximum Holes: | 0.3mm/ 1.0mm |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.15mm ±0.05 |
| Surface Finish | Immersion gold |
| Solder Mask Apply To: | TOP, bottom |
| Solder Mask Color: | Yellow Coverlay |
| CONTOUR/CUTTING | Punching |
| Stiffener: | N/A |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications:
Computers
Mobile phones
Digital cameras
VCRs
Flat panel displays
Instruments and apparatus
Automotive electronics
Parameter of SF202:
| Test Item | Test Method | Unit | IPC Standard | Typical Value | ||
| SF202 0512DT | ||||||
| Peel Strength 90° | IPC-TM-650,No.2.4.9 Method A Method C |
N/mm | ≥0.525 ≥0.525 |
1.2 1.2 |
||
| Thermal Stress | IPC-TM-650,No.2.4.13 | - | Pass | Pass | ||
| Dimensional Stability | IPC-TM-650,No.2.2.4 Method B |
% | ±0.2 | MD: 0.01 TD: 0 |
||
| Chemical Resistance | IPC-TM-650,No.2.3.2 | % | ≥80 | 85 | ||
| Moisture Absorption | IPC-TM-650,No.2.6.2 | % | ≤2 | 1.3 | ||
| Volume Resistivity | IPC-TM-650,No.2.5.17 | MΩ-cm | ≥106 | 4.8×108 | ||
| Surface Resistance | IPC-TM-650,No.2.5.17 | MΩ | ≥105 | 1.2×106 | ||
| Dielectric Constant 1GHz | PC-TM-650,No.2.5.5.9 | - | - | 3.2 | ||
| Dissipation Factor 1GHz | PC-TM-650,No.2.5.5.9 | - | - | 0.007 | ||
| Bending resistance | R0.38×4.9N,with cvl | Times | - | >2000 | ||
| Dielectric Strength | IPC-TM-650,No.2.5.6.2 | V/μm | ≥80 | 150 | ||
FPC Capabilities:
| Flexible Printed Circuit Capability | ||
| No. | Specifications | Capabilities |
| 1 | Board Type | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| 2 | Base Material | PI, PET |
| 3 | Copper Weight | 0.5oz, 1oz, 2oz |
| 4 | LED Maximum Size | 250 x 5000mm |
| 5 | General Maximum Size | 250 x 2000mm |
| 6 | Board Thickness | 0.03mm-3.0mm |
| 7 | Thickness Tolerance | ±0.03mm |
| 8 | Mininum Drill Hole | 0.05mm |
| 9 | Maximum Drill Hole | 6.5mm |
| 10 | Tolerance of Drill Hole | ±0.025mm |
| 11 | Thickness of Hole Wall | >= 8 um |
| 12 | Minimum Track/Gap of Single Layer Board | 0.025/0.03mm |
| 13 | Minimum Track/Gap of Double Layer and Multilayer Board | 0.03/0.040mm |
| 14 | Etching Tolerance | ±0.02mm |
| 15 | Minimum Width of Silk Legend | >= 0.125mm |
| 16 | Minimum Heigh of Silk Legend | >=0.75mm |
| 17 | Distance from Legend to Pad | >=0.15mm |
| 18 | Distance from Opening Solder Mask of Drill Coverlay to Track | >=0.03mm |
| 19 | Distance from Opening Solder Mask of Punching Coverlay to Track | >=0.03mm |
| 20 | Thickness of Immersion Nickel | 100-300u" |
| 21 | Thickness of Immersion Gold | 1-3u" |
| 22 | Thicnkess of Immersion Tin | 150-400u" |
| 23 | Minimum Electrical Testing Pad | 0.2mm |
| 24 | Minimum Tolerance of Outline(Normal Steel Mould Punch) | ±0.1mm |
| 25 | Minimum Tolerance of Outline (Precision Steel Mould Punch) | ±0.05mm |
| 26 | Mininum Radius of Bevel Angle (Outline) | 0.2mm |
| 27 | Stiffner Material | PI, FR-4, 3M Adhesive, PET, Steel Sheet |
| 28 | RoHs | Yes |
| 29 | Solder Mask Colour | Yellow, White, Black, Green |
){kind=link}