Rogers 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green Mask for Ground Radar Warning

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0834-V8.34
• Material: Ceramic-PTFE Composite
• Application: Radars
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Glass Reinforced Hydrocarbon
• Board Thick: 10mil (0.254mm), 25mil (0.635mm) 50mil (1.27mm), 7
• Surface Finish: Bare Copper, HASL, Enig, Immersion Tin, Immersion
• Copper Weight: 0.5oz , 1oz, 2oz
• Solder Mask: Green, Black, Blue, Yellow, Red etc
• Transport Package: Vacuum
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

Rogers 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green Mask  for Ground Radar Warning
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Hi Guys,
Today we're going to talk about Rogers 6006 PCB.

Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.

PCB Capability (RT/duroid 6006)

PCB Material:	Ceramic-PTFE composite
Designator:	RT/duroid 6006
Dielectric constant:	6.15  ±0.15 (process)
	6.45 (design)
Layer count:	1 Layer, 2 Layer
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 25mil (0.635mm)
	50mil (1.27mm), 75mil (1.90mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP.

RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.   It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

Features and Benefits

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Tight DK and thickness control for repeatable circuit performance

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

Thank you for your reading.

Appendix: Properties of RT/duroid 6006 laminates.

RT/duroid 6006 Typical Value
Property	RT/duroid 6006	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.15	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign	6.45	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0027	Z		10 GHz/A	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-410	Z	ppm/ºC	-50ºC-170ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	7 x 10^7		Mohm.cm	A	IPC 2.5.17.1
Surface Resistivity	2 x 10^7		Mohm	A	IPC 2.5.17.1
Tensile Properties					ASTM D638 (0.1/min. strain rate)
Young's Modulus	627(91)        517(75)	X                           Y	MPa(kpsi)	A
Ultimate Stress	20(2.8)         17(2.5)	X                    Y	MPa(kpsi)	A
Ultimate Strain	12 to 13                   4 to 6	X                    Y	%	A
Compressive Properties					ASTM D695 (0.05/min. strain rate)
Young's Modulus	1069 (115)	Z	MPa(kpsi)	A
Ultimate Stress	54(7.9)	Z	MPa(kpsi)	A
Ultimate Strain	33	Z	%
Flexural Modulus	2634 (382)      1951 (283)	X	MPa(kpsi)	A	ASTM D790
Ultimate Stress	38 (5.5)	X                    Y	MPa(kpsi)	A
Deformation under load	0.33                     2.1	Z                    Z	%	24hr/50ºC/7MPa   24hr/150ºC/7MPa	ASTM D261
Moisture Absorption	0.05		%	D48/50ºC 0.050"(1.27mm) thick	IPC-TM-650 2.6.2.1
Thermal Conductivity	0.49		W/m/k	80ºC	ASTM C518
Coefficient of Thermal Expansion	47 34 117	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.41
Td	500		ºC TGA		ASTM D3850
Density	2.7		g/cm^3		ASTM D792
Specific Heat	0.97(0.231)		j/g/k (BTU/ib/^OF)		Calculated
Copper Peel	14.3 (2.5)		pli (N/mm)	after solder float	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes