Immersion Gold PCB with Black Solder Mask Volume Production with V-Groove

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0425-V4.25
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 41.89 Um (1oz)
• Final Height of PCB: 1.56-1.65mm
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 7.7 Mil
• Minimum Gap(Mil): 6.2 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 248.82 x 235.20mm=24UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer printed circuit board built on FR-4 Tg135 substrate for the application
of Control System. It's 1.6 mm thick without silkscreen on black solder mask and immersion
gold on pads. The base material is from ITEQ supplying 24 up boards per panel. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed
for shipment. 

1.2 Features and benifits    
    
A. It's suitable for handheld and consumer applications.
B. Excellent surface planarity for CSP mounted components to reduce failure rate during
     assembly and soldering.
C. Meeting your PCB needs from prototype to mass production.
D. Products and Manufacturing are certified by authorized organizations.
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user

1.3 Application
    
WiFi Extender, Bluetooth USB, GSM Repeater, Broadband Router, Electronic Board,Tracker
Car, DC-DC Converters, Broadband Routers, GSM GPRS Modem, Cat scan technology

1.4 Parameter and data sheet

Number of Layers	2
Board Type	Double Sided PCB
Board size	248.82 x 235.20mm=24UP
Board Thickness	1.56-1.65mm
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	41.89 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-6189BK31
Solder Mask Supplier	KUANG SHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	N/A
Supplier of Silkscreen	N/A
Color of Silkscreen	N/A
Number of Silkscreen	N/A
Mininum Trace (mil)	7.7 mil
Minimum Gap(mil)	6.2 mil
Surface Finish	Immersion Gold
RoHS Required	Yes
Warpage	0.25%
Drill table (mm)
T1	0.700
T2	0.800
T3	0.900
T4	1.000
T5	1.400
T6	1.600
T7	3.500
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2

Disposal prior to Solder mask