1.1 General description
This is a type of no copper PCB built on FR-4 Tg135 substrate for the application of
spacer. It's 1.57 mm thick without mask. The base material is from ILM supplying 1
up single board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 25 panels are packed for shipment.
1.2 Features and benifits
A. It's suitable for handheld and consumer applications.
B. Excellent dimensionaly stability
C. PCB manufacturing on required specifications.
D. Delivery on time. Higher than 98% on-time-delivery rate.
E. RoHS materials
F. Experienced sales persons and skilled customer services
1.3 Application
Switch,Alarm System, AC To DC Converter, Long Range WiFi Antenna, WiFi Antenna Booster,
Vehicle GPS, GPS Auto Tracker, Security Access, Modem Cdma, Timing circuits
1.4 Parameter and data sheet
| Number of Layers |
N/A |
| Board Type |
Blank Spacer |
| Board Size |
78.36 x 52.83mm=1UP |
| Board Thickness |
1.5mm +/-0.15 |
| Board Material |
FR-4 |
| Board Material Supplier |
ILM |
| Tg Value of Board Material |
TG135ºC |
| |
| PTH Cu thickness |
N/A |
| Inner Iayer Cu thicknes |
N/A |
| Surface Cu thickness |
N/A |
| |
| Solder Mask Type and Model No. |
N/A |
| Solder Mask Supplier |
N/A |
| Solder Mask Colour |
N/A |
| Number of Solder Masks |
N/A |
| Thickness of Solder Mask |
N/A |
| |
| Type of Silkscreen Ink |
N/A |
| Supplier of Silkscreen |
N/A |
| Color of Silkscreen |
N/A |
| Number of Silkscreen |
N/A |
| |
| Mininum Trace (mil) |
N/A |
| Minimum Gap(mil) |
N/A |
| |
| Surface Finish |
N/A |
| RoHS Required |
Yes |
| Warpage |
0.15% |
| |
| Thermal Shock Test |
Pass, 288±5ºC,10 seconds, 3 cycles.
No delamination, no blistering. |
| Solderablity Test |
N/A |
| Function |
visual inspection |
| Workmanship |
Compliance with IPC-A-600H & IPC-6012C Class 2 |
Audited Supplier 
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