RO4003c Double-Sided 32mil Substrate PCB: High-Frequency Board with Green Solder Mask for RF Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1134-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4003C Double-Sided 0.9mm PCB: High-Frequency Board with 6/5 Mils Trace/Space for RF Applications
(All PCBs are custom-manufactured. Specifications may vary based on design requirements.)


1. Overview of This PCB
Designed for high-performance RF systems, this double-sided PCB utilizes Rogers RO4003C laminate to deliver exceptional electrical performance and cost efficiency. Engineered for 5G infrastructure, automotive radar, and satellite communications, it combines the low-loss characteristics of premium materials with the manufacturability of standard FR-4 processes. Certified to IPC-Class-2 standards, this PCB ensures reliability in demanding environments.

Key Benefits:
Signal Integrity: Dielectric constant (3.38±0.05 @10GHz) and low loss tangent (0.0027 @10GHz)

Thermal Management: 0.71 W/m/°K conductivity with CTE of 11/14/46 ppm/°C

Cost Efficiency: Standard FR-4 processing reduces manufacturing costs by 40% vs PTFE

Global Availability: Prototype to production quantities worldwide


2. PCB Construction Details

Parameter	Specification
Material	Rogers RO4003C
Thickness	0.9mm (32mil core)
Copper Weight	1oz outer layers (35µm)
Trace/Space	6/5 mils
Min Hole Size	0.35mm
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Green (both sides)
Silkscreen	White (both sides)
Thermal Conductivity	0.71 W/m/°K

3. Key Features & Specifications

Stackup Structure
Top/Bottom Layers: 35µm copper with ENIG finish

Dielectric Core: 0.813mm RO4003C substrate


Design Specifications
Components: 66 total (81 thru-hole, 72 SMT)

Interconnects: 153 pads, 120 vias

Circuit Complexity: 4 independent nets

Quality Assurance: 100% electrical testing


Material Advantages
Frequency Stability: ±0.05 Dk tolerance from 1-40GHz

Thermal Reliability: Tg >280°C with -40°C to +85°C operation

CAF Resistant: Enhanced plated through-hole reliability

Process Compatibility: Standard FR-4 fabrication


4. Typical Applications
5G Infrastructure: Massive MIMO antennas, power amplifiers

Automotive Radar: 77GHz ADAS sensors

Satellite Systems: LNB modules, phased arrays

RFID Systems: High-frequency tags and readers


Why Choose This PCB?
1. Performance/Cost Balance: Rogers quality at FR-4 pricing
2. Manufacturing Simplicity: No special PTFE processing required
3. Design Flexibility: Supports hybrid multilayer constructions


Order Now for Reliable RF Performance!
Contact us for:
• Custom impedance control designs
• Prototype lead time: 5 business days
• Volume production quotes
(Global IPC-certified manufacturing facilities)

Tags: RO4003C PCB, Double-Sided RF Board, 6/5 Mils Trace/Space, ENIG Finish, Automotive Radar PCB, 5G Antenna Board



Thank you for your reading and you're welcome to contact us for your PCB enquiries.