Multilayer PCB 4 Layer Copper with Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0364-V3.64
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1oz)
• Inner Iayer Cu Thicknes: 35 Um (1oz)
• Final Height of PCB: 1.6mm +/-0.16
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 7.9 Mil
• Minimum Gap(Mil): 5.5 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 204 x 122mm=8UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg135 substrate for the application of Vehicle
Tracking Device. It's 1.6 mm thick without silkscreen on black solder mask and immersion gold
on pads. The base material is from ITEQ supplying 8 up boards per panel. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

1.2 Features and benifits    
    
A. RoHS compliant and suitable for thermal reliability needs
B. Excellent surface planarity for CSP mounted components to reduce failure rate during
     assembly and soldering.
C. AOI inspection
D. Delivery on time. Higher than 98% on-time-delivery rate.
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user

1.3 Application
    
TV Antenna, Voltage Converter, Travel Router, Toroidal Transformer, Variable Speed Drive,
GPS GSM Tracker, Voltage Converters, PLC Control System,    DC DC Convertor, Computers

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	204 x 122mm=8UP
Board Thickness	1.6mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-S6189BK31
Solder Mask Supplier	KUANGSHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	n/a
Supplier of Silkscreen	n/a
Color of Silkscreen	n/a
Number of Silkscreen	n/a
Mininum Trace (mil)	7.9 mil
Minimum Gap(mil)	5.5 mil
Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.25%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.6
	T2: 0.8
	T3: 1.0
	T4: 2.3
	T5: 3.2

Film Exposure machine