Rt/Duroid 6035HTC 2-Layer 0.6mm High-Thermal-Conductivity PCB - Bare Copper RF Power Board Solution

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6035HTC
• Model NO.: BIC-1117-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RT/duroid 6035HTC 2-Layer 0.6mm High-Thermal-Conductivity PCB - Bare Copper RF Power Board Solution
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. High-Power RF Circuit Board Overview
At Bicheng Technologies, we proudly present our RT/duroid 6035HTC 2-layer PCB, specifically engineered for demanding high-power RF and microwave applications. This 0.6mm thick circuit board features Rogers' advanced ceramic-filled PTFE composite material, delivering exceptional thermal conductivity (1.44 W/m/K) - 2.4 times greater than standard RT/duroid 6000 series materials.

Key Advantages for Power Applications:

Superior Heat Dissipation: Maintains lower operating temperatures in high-power designs

Ultra-Low Loss Performance: tanδ=0.0013 at 10GHz for pristine signal integrity

Enhanced Drilling Efficiency: Advanced filler system extends tool life by 30%

Thermally Stable Copper: Reverse-treated foil for optimal thermal management

Bare Copper Construction: Immersion silver finish maximizes thermal transfer

 

2. Enhanced Construction Specifications

Parameter	Bicheng's Specification
Base Material	Rogers RT/duroid 6035HTC (certified)
Board Dimensions	150.2×66.5mm (±0.15mm)
Layer Count	2-layer rigid construction
Finished Thickness	0.6mm (0.508mm core)
Copper Weight	1oz (35μm) both sides
Trace/Space	7/7 mils
Minimum Hole Size	0.5mm (mechanical drill)
Via Plating	20μm minimum
Surface Finish	Immersion Silver
Solder Mask	None (maximizes thermal transfer)
Silkscreen	None
Thermal Conductivity	1.44 W/m/K at 80°C
Quality Standard	IPC-Class-2 with 100% testing

3. Technical Features & Power Applications
Advanced Stackup Architecture:

Top Layer: 35μm Cu + Immersion Silver

Core: 0.508mm RT/duroid 6035HTC (Dk=3.5)

Bottom Layer: 35μm Cu + Immersion Silver


Design Specifications:

Components: 15 devices (31 SMT/37 thru-hole)

Interconnects: 39 vias (0.5mm)

Signal Paths: 4 controlled nets

Thermal Management: Optimized for heat dissipation


Material Benefits:

High Power Handling: 3× better thermal performance vs standard materials

Frequency Stability: -66ppm/°C thermal coefficient of Dk

Moisture Resistance: 0.06% absorption in humid environments

Drilling Efficiency: Saves 20% on fabrication costs vs alumina-filled materials


Typical Power Applications:

5G Base Stations: High-power amplifier modules

Defense Systems: Radar transmitter circuits

Satellite Comms: High-power RF payloads

Industrial RF: High-power combiners/dividers


Why Engineers Choose This Solution?

Proven Thermal Performance: 150+ successful high-power designs

Reliable Construction: IPC Class 2 with full electrical testing

Fast Prototyping: 7-day turnaround for evaluation boards

Global Support: DHL shipping to all major markets


Start Your High-Frequency Design
Contact Sally for technical consultation or to request DfM guidelines. Prototype lead times as fast as 5 business days available.


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