4 Layer PCB Expoy Glass with Immersion Gold Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0445-V4.45
• Material: Fiberglass Epoxy
• Application: Medical Instruments
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1oz)
• Inner Iayer Cu Thicknes: 35 Um (1oz)
• Final Height of PCB: 1.6mm +/-0.16
• Surface Finish: Immersion Gold 2u"
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 0.2mm
• Minimum Gap(Mil): 0.21mm
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 199.07 x 180.34 mm =1up
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 Tg170 substrate for the application
of Wireless Broadband. It's 1.6 mm thick with white silkscreen on green solder mask and
immersion gold on pads. The base material is from ITEQ supplying 1 up single board. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for
shipment. 

1.2 Features and benifits    
    
A. Low Z-CTE and excellent through hole reliability
B. Good oxidation resistance and good heat dissipation.
C. Strict WIP inspection and monitoring as well as working instruction
D. Meeting your PCB needs from prototype to mass production.
E. Quick Lead time: 3-5 days
F. ISO9001, ISO14001, TS16949, UL Certified

1.3 Application
    
Access Point, Signal Generator, Car GPS Tracker, Vehicle Tracking Device, Modem Wireless,
External WiFi Antenna, Embedded Web Server, Logic Controller, Remote Access Control,
Regulators

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	199.07 x 180.34 mm =1up
Board Thickness	1.60 mm +/-0.16
Board Material	FR-4 (S1000-2)
Board Material Supplier	Shengyi
Tg Value of Board Material	170ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, LP-4G G-05
Solder Mask Supplier	NANYA
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	18 um
Type of Silkscreen Ink	S-380W
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2
Mininum Trace (mil)	0.2mm
Minimum Gap(mil)	0.21mm
Surface Finish	Immersion Gold 2u"
RoHS Required	Yes
Warpage	0.22%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting  Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table(mm)
T1	0.600
T2	0.900
T3	1.020
T4	1.100
T5	2.110
T6	2.500
T7	3.000
T8	3.500

PCB Pattern plating