1.1 General description
This is a type of 4 layer flexible printed circuit for the application of Electronic Counter.
The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using supplied
Gerber data. Polyimide stiffner is applied on the inserting part.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Diversified shipping method
L. Eligible products rate of first production: >95%
1.3 Application
LCD module, Mobile phone antenna flex board, Consumer card reader soft board
1.4 Parameter and data sheet
| Size of Flexible PCB |
50.22 X 122.17mm |
| Number of Layers |
4 |
| Board Type |
Flexible PCB |
| Board Thickness |
0.25mm |
| Board Material |
Poyimide 25µm |
| Board Material Supplier |
ITEQ |
| Tg Value of Board Material |
60ºC |
| |
| PTH Cu thickness |
≥20 µm |
| Inner Iayer Cu thicknes |
N/A |
| Surface Cu thickness |
70 µm |
| |
|
| Coverlay Colour |
Yellow |
| Number of Coverlay |
1 |
| Thickness of Coverlay |
25 µm |
| Stiffener Material |
Polyimide |
| Stiffener Thickness |
0.2mm |
| |
|
| Type of Silkscreen Ink |
IJR-4000 MW300 |
| Supplier of Silkscreen |
TAIYO |
| Color of Silkscreen |
White |
| Number of Silkscreen |
1 |
| |
| Peeling test of Coverlay |
No peelable |
| Legend Adhesion |
3M 90ºC No peeling after Min. 3 times test |
| |
| Surface Finish |
Immersion Gold |
| Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required |
Yes |
| Famability |
94-V0 |
| |
| Thermal Shock Test |
Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles.
No delamination, no blistering. |
| Function |
100% Pass electrical test |
| Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
Main flexible PCBs
PCB Grinding Machine
Audited Supplier 
){kind=link}