| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| PCB SIZE | 93 x 92mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB, 2 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+plate TOP layer |
| RO4350B 30mil (0.762mm) | |
| copper ------- 17.8um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11.97mil |
| Minimum / Maximum Holes: | 0.3/2.8mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 195 |
| Number of Milled Slots: | 5 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | No |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 30mil (0.762mm), Tg 288ºC |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.8mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCB DOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23ºC | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23ºC 2.5 GHz/23ºC |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/ºC | -50ºCto 150ºC | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150ºC | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/ºC | -55ºCto288ºC | IPC-TM-650 2.4.41 |
| Tg | >280 | ºC TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ºC TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80ºC | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50ºC |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23ºC | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
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