| Customization: | Available |
|---|---|
| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide (50 µm) |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
Introducing our Heavy Copper Flexible Printed Circuit (FPC), specifically designed for AC power systems. This 2-layer polyimide FPC, measuring 0.3mm in thickness, features 2 oz copper. The base laminate is sourced from Shengyi, complemented by a 0.1mm FR-4 stiffener on the back. Manufactured according to IPC 6012 Class 2 standards using provided Gerber data, this FPC ensures high reliability and performance.
Features and Benefits:
Excellent Flexibility: Designed to withstand bending and twisting without compromising performance.
Reduced Volume: Compact design that saves space in applications.
Weight Reduction: Lightweight materials contribute to overall system efficiency.
Consistent Assembly: Reliable manufacturing processes ensure uniform assembly results.
Increased Reliability: Enhanced durability for long-lasting performance.
Whole Soldering Capability: The ends can be fully soldered for improved connections.
Cost-Effectiveness: Affordable solutions for high-quality flexible circuits.
Seamless Processing: Streamlined production processes for efficiency.
On-Time Service: Commitment to meeting delivery timelines.
Quick Lead Time: Fast turnaround of 3-5 days.
Parameter and data sheet
| Size of Flexible PCB | 130.66 X 40.67mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.30mm |
| Board Material | Polyimide 50µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 70 µm |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | FR-4 |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
Ideal for various applications including:
General-purpose LED soft light strips
Mobile phone antenna flex boards
Industrial control systems
Temperature controller soft boards
Copper Foils:
We offer two types of copper foils for your flexible circuits: Electro-Deposited (ED) copper foils and Rolled and Annealed (RA) copper foils.
1.Electro-Deposited (ED) Copper Foils:
Produced by depositing copper on a stainless steel drum in a plating tank.
Characterized by a vertical grain structure, offering lower ductility.
Not recommended for dynamic applications.
2.Rolled and Annealed (RA) Copper Foils:
Made from electrolytically deposited cathode copper, providing a horizontal grain structure.
Offers superior flexibility and endurance, making it suitable for dynamic applications.
Can be enhanced with electrolytic copper flash for improved adhesion.
The 4-Layer Multilayer FPC is a high-performance, cost-effective solution designed for applications requiring both flexibility and high-density interconnection. With its excellent flexibility, increased reliability, and low cost, it is an ideal choice for engineers working on wireless routers, medical devices, and consumer electronics.
Whether you're designing for compact electronic devices or specialized industrial applications, the 4-Layer Multilayer FPC offers the reliability and performance you need to bring your projects to life.
More Displays of Heavy Copper Flex:
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