High Density Multilayer PCB 6 Layer Copper with Immersion Gold

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0441-V4.41
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Cu Thickness
35 Um (1oz)
Inner Iayer Cu Thicknes
35 Um (1oz)
Final Height of PCB
1.6mm +/-0.16
Surface Finish
Immersion Gold
Solder Mask Color
Green
Colour of Component Legend
White
Mininum Trace (Mil)
7 Mil
Minimum Gap(Mil)
4.9 Mil
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
54.99 x 87.50mm=1UP
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application
of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and
immersion gold on pads. The base material is from ITEQ supplying 1 up single board. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for
shipment. 

1.2 Features and benifits    
    
A. RoHS compliant and suitable for high thermal reliability needs
B. Excellent surface planarity for CSP mounted components to reduce failure rate during
     assembly and soldering.
C. Reliability test, insulation resistance test and ionic contamination test
D. 16000 square meter workshop
E. 12 hours quotation
F. No quality complaint is meant to save money

1.3 Application
    
HDMI Switch, Inverters,Car Inverter, Router ADSL,Gigabit Switches, Industrial Computer,PLC
Control, Control Access, Digital Repeater, Weather analysis

1.4 Parameter and data sheet
Number of Layers 6
Board Type Multi-layer PCB
Board size 54.99 x 87.50mm=1UP
Board Thickness 1.6mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170ºC
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM,  PSR-2000GT600D
Solder Mask Supplier TAiYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 13um
 
Type of Silkscreen Ink TAIYO, IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Mininum Trace (mil) 7 mil
Minimum Gap(mil) 4.9 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Drill table (mm)  
T1 1.000 
T2 3.175 
   
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. 
No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm) T1: 0.600
T2: 0.700
T3:0.800
T4: 1.000
T5: 1.100
T6: 1.250
T7: 1.850
T8: 4.000
T9: 4.325


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