RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RF-10
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  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
  • RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
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Basic Info.

Model NO.
BIC-182-V2.1
Material
Ceramic Filled PTFE and Woven Fiberglass
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Brand
Taconic
Thickness
60mil
Layer Count
2-Layer
Application
RF Applications
Surface Finish
Immersion Gold
Transport Package
Kk Paper, 3-Layer Wrinkle
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

RF-10 High Frequency PCB 60mil 1.524mm Taconic Microwave PCB Double Sided Low Loss High DK RF PCBs
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
This particular low - loss, high DK printed circuit board  is constructed on a 60 - mil RF - 10 substrate. RF - 10 PCB features a double - layer build - up design, with a substantial area of immersion gold plating and a partial green solder mask. Both sides of the board are equipped with 1 - ounce finished copper, ensuring excellent electrical conductivity.

Manufactured in accordance with IPC 6012 Class 2 standards, the production process utilizes the provided Gerber data to guarantee precision and quality. Taconic RF - 10 PCBs are carefully packaged in bundles of 25 for shipment, ensuring they reach their destination in optimal condition.

PCB Specifications
PCB SIZE 90 x 100mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
RF-10 1.524mm
copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 4.0 mm
Number of Different Holes: 5
Number of Drill Holes: 211
Number of Milled Slots: 5
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  RF-10 1.524mm
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold, 89%
Solder Mask Apply To:  Top layer
Solder Mask Color:  Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 

Typical Applications
  1. Aircraft Collision Avoidance Systems
  2. GPS Antennas
  3. Microstrip Patch Antennas
  4. Passive Components (filters, couplers, power dividers)
  5. Satellite Components
RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
 
RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

Why choose us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years' high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We're a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000 workshop, 30000 output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3

Typical Value of RF-10
RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500  % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 
RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design
RF-10 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

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