Tsm-Ds3 -Thin RF PCB - 5mil 2-Layer Board with 4/7 Mils Trace/Space for High-Power Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tsm-Ds3
• Model NO.: BIC-1219-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

TSM-DS3 Ultra-Thin RF PCB - 0.2mm 2-Layer Board with 4/7 Mils Trace/Space for High-Power Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This ultra-thin 2-layer RF PCB features TSM-DS3 ceramic-filled laminate, delivering exceptional performance for high-power and millimeter wave applications. With an ultra-slim 0.2mm profile and 4/7 mils trace/space capability.

This board is engineered for:

High-power RF systems requiring efficient thermal management (0.65 W/mK conductivity)

Precision phased array antennas needing stable dielectric properties (Dk=3.0±0.05)

Demanding environments where dimensional stability is critical (CTE matched to copper)

The material's minimal fiberglass content (5%) combines the manufacturing benefits of epoxy with the performance of advanced RF laminates, making it ideal for complex, large-format designs.



2. Technical Specifications

Parameter	Specification
Base Material	TSM-DS3
Dimensions	82×82mm (±0.15mm)
Layers	2
Thickness	0.2mm
Copper Weight	1oz (35μm)
Min Trace/Space	4/7 mils
Min Hole Size	0.4mm
Surface Finish	Immersion Silver
Solder Mask	None
Silkscreen	None
Via Count	151
Testing	100% Electrical

Layer Structure:
Top Layer: 35μm Cu

Core: 0.127mm TSM-DS3

Bottom Layer: 35μm Cu


3. Performance Features & Applications
Material Advantages

Ultra-Low Loss: Df=0.0014 @10GHz for high-frequency precision

Thermal Management: 0.65 W/mK conductivity prevents hot spots

Dimensional Stability: CTE matched to copper (10/16/23 ppm/°C)

Moisture Resistance: Only 0.07% absorption

Manufacturing Efficiency: Processes like epoxy with RF performance


Design Specifications

Components: 36 (31 SMT, 132 thru-hole)
Pads: 163 total
Nets: 2
Artwork: Gerber RS-274X
Standard: IPC-Class 2


Target Applications

Phased Array Radar Systems: Military and aerospace

5G mmWave: Base station antennas

Automotive Radar: ADAS and collision avoidance

Oil Exploration: Downhole monitoring equipment

Semiconductor Testing: High-frequency ATE systems


Why Choose This PCB?
1. High-Power Ready: Excellent thermal conductivity
2. Manufacturing Friendly: Processes like standard epoxy
3. Ultra-Thin Profile: 0.2mm for compact designs
4. Stable Performance: Temperature-stable Dk (±0.25%)
5. Reliable Finish: Immersion silver for high-frequency applications


Available Options:
Custom impedance control

Alternate surface finishes

Special thermal testing

Panelization services


Tags:
TSM-DS3 PCB, 2-Layer RF Board, 0.2mm Ultra-Thin PCB, No Solder Mask Design, Immersion Silver Finish, High-Power RF Circuit, Phased Array Antenna PCB, Millimeter Wave Board, IPC-Class 2 Compliant

Contact Our RF Specialists for design consultation or production quotes. Ideal for engineers developing advanced radar and communication systems.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.