Rogers RO4360g2 PCB Manufacturing of Shenzhen Electronics Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-117-V2.1
• Material: Hydrocarbon Ceramic-Filled Thermoset Materials
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Application: Radar
• Surface Finish: Immersion Gold
• Layer Count: 2-Layer
• Thickness: 24 Mil
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

24mil Rogers RO4360G2 PCB  With Immersion Gold for Ground-based Radar
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

The RO4360G2 PCBs from Rogers Corporation are advanced, low - loss materials with a dielectric constant (Dk) of 6.15. These thermoset materials, reinforced by glass and filled with hydrocarbon ceramic, provide an excellent combination of performance and processability.
The RO4360G2 laminates are lead - free friendly and have improved rigidity. This simplifies the production of multi - layer boards and reduces the overall cost.
Similar to FR - 4 in terms of processing, RO4360G2 substrates are compatible with automated assembly. They have a low Z - axis CTE, which gives more flexibility in design. They possess the high Tg characteristic of the RO4000 series and can be used together with RO4450F prepreg and lower - Dk RO4000 laminates in multi - layer designs.
With a Dk of 6.15 (Design Dk 6.4), RO4360G2 PCBs make it possible to design compact circuits, making them ideal for applications where size and cost are critical considerations. They are an economical solution for power amplifiers, patch antennas, ground - based radar, and various RF applications.


Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,

2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible

3. Environmentally friendly
1.) Lead free process compatible

4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain
 

Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
 

PCB Capability (RO4360G2)

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property	RO4360G2	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.15	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
				2.5 GHz/23ºC
Dissipation Factor,tanδ	0.0038	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Conductivity	0.75		W/mK	50ºC	ASTM D-5470
Volume Resistivity	4.0 X 1013		Ω.cm	Elevated T	IPC-TM-650  2.5.17.1
Surface Resistivity	9.0 X 1012		Ω	Elevated T	IPC-TM-650  2.5.17.1
Electrical Strength	784	Z	V/mil		IPC-TM-650  2.5.6.2
Tensile Strength	131 (19)     97(14)	X                 Y	MPa (kpsi)	40 hrs 50%RH/23	ASTM D638
Flexural Strength	213(31)     145(21)	X                 Y	Mpa (kpsi)	40 hrs 50%RH/23	IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion	13                     14                              28	X                      Y                         Z	ppm/ºC	-50 ºCto 288ºC  After Replicated Heat Cycle	IPC-TM-650, 2.1.41
Tg	>280		ºC TMA		IPC-TM-650 2.4.24.3
Td	407		ºC		ASTM D3850 using TGA
T288	>30	Z	min	30 min / 125ºC Prebake	IPC-TM-650 2.2.24.1
Moisure Absorption	0.08		%	50ºC/48hr	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er	-131 @10 GHz	Z	ppm/ºC	-50ºC to 150 ºC	IPC-TM-650, 2.5.5.5
Density	2.16		gm/cm3	RT	ASTM D792
Copper Peel Stength	5.2 (0.91)		pli (N/mm)	Condtion B	IPC-TM-650 2.4.8
Flammability	V-0				UL 94 File QMTS2. E102765