60mil Rt/Duroid 6035HTC PCB Manufacturing of Shenzhen Electronics Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-128-V2.1
• Material: Ceramic-Filled PTFE Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 60mil
• Layer Count: 2-Layer
• Application: RF and Microwave
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

 60mil RT/duroid 6035HTC PCB Manufacturing of Shenzhen Electronics Circuit board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Rogers Corporation's RT/duroid 6035HTC high - frequency circuit materials are ceramic - filled PTFE composites intended for high - power RF and microwave applications. Their thermal conductivity is almost 2.4 times as much as that of the standard RT/duroid 6000 products. The copper foil (both electrodeposited and reverse - treated) on these laminates has excellent long - term thermal stability. Consequently, RT/duroid 6035HTC laminates are a top - notch option for high - power applications.

Features:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

1. Low loss tangent

Excellent high frequency performance

1. Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

1. Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

Some Typical Applications:

1. High Power RF and Microwave Amplifiers
2. Power amplifiers, Couplers, Filters
3. Combiners, Power Dividers

PCB Capability (RT/duroid 6035HTC)

PCB Capability (RT/duroid 6035HTC)
PCB Material:	Ceramic-filled PTFE composites
Designation:	RT/duroid 6035HTC
Dielectric constant:	3.50±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RT/duroid 6035HTC 

Property	Typical Value RT/duroid 6035HTC	Direction	Unit	Condition	Test Method
Dielectric Constant, εr Process	3.50 ± 0.05	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εr Design	3.6	Z	-	8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor,	0.0013	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	-66	Z	ppm/°C	-50°C to 150°C	mod IPC-TM-650, 2.5.5.5
Dielectric Strength	835	-	V/Mil	15 mil thickness	IPC-TM-650, 2.5.6.2
Breakdown Voltage	12.59	-	kV	15 mil thickness	IPC-TM-650, 2.5.6
Volume Resistivity	108	-	M•cm	COND A	IPC-TM-650, 2.5.17.1
Surface Resistivity	108	-	M	COND A	IPC-TM-650, 2.5.17.1
Tensile Modulus	329 244	MD     CMD	kpsi	40 hrs @ 23°C/50RH	ASTM D638
Dimensional Stability	-0.11 -0.08	CMD     MD	mm/m (mils/inch)	0.030" 1 oz EDC foil Thickness after etch +E4/105	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion (-55 to 288 °C)	19	X	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
	19	Y
	39	Z
Thermal Conductivity	1.44	-	W/m/K	80°C	ASTM C518
Moisture Absorption	0.06	-	%	D24/23	IPC-TM-650 2.6.2.1 ASTM D570
Density	2.2	-	gm/cm3	23°C	ASTM D-792
Copper Peel Strength	7.9	-	pli	20 sec.@ 288°C	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL  94
Lead-Free Process Compatible	YES