Rogers Tmm13I Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tmm13I
• Model NO.: BIC-159-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 15mil 20mil 25mil 60mil
• Layer Count: Single Layer, Double Layer, Multilayer, Hybrid PCB
• Application: Stripline and Microstrip
• Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin, etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil RF PCB With Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers' TMM13i thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 12.85 and dissipation factor of 0.0019.

TMM13i has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM13i is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

Since TMM13i is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


 

Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
 

Our PCB Capabilities (TMM13i)  

PCB Capability (TMM13i)
PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM13i
Dielectric constant:	12.85±0.35
Layer count:	Single Layer,Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc..

Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years' high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We're a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000 workshop, 30000 output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3

Typical Value of TMM13i

TMM13i Typical Value
Property		TMM13i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		12.85±0.35	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		12.2	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.0019	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-70	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		-	-	Mohm.cm	-	ASTM D257
Surface Resistivity		-	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		213	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		-	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		4.0 (0.7)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		-	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.13
Specific Gravity		3	-	-	A	ASTM D792
Specific Heat Capacity		-	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-