Heavy Copper PCB Board 6 Oz Circuit Board 4 Layer

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW
  Support payments in USD
Secure payments: Every payment you make on Made-in-China.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Secured Trading Service
Gold Member Since 2017

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

to see all verified strength labels (14)
Find Similar Products

Basic Info.

Model NO.
BIC1033R3.3
Material
Fiberglass Epoxy
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Finish
Immersion Gold
Solder Mask Color
Green
Legend Color
White
Board Thick
1.66mm
Outer Copper Foil
6 Oz
Inner Copper Thick
2 Oz
Minimum Trace and Space
15 Mil/17 Mil
Minimum / Maximum Holes
0.5/3.251mm
Via
Plated Through Hole(Pth)
Test
100% Electrical Test
Transport Package
Vacuum
Specification
139.99 x 110.85mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

Printed Circuit Board Prototype PCB manufacturer Heavy Copper PCB 6oz Copper Applied
In Power Supply


Commodity Introduction
This is a type of FR-4 PCB for the application of Power Supply. It's a 4  layer board at 1.6mm
thick.The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed
separately. 


Parameters & Data Sheet
PCB SIZE 139.99 x 110.85mm=1PCS
BOARD TYPE  
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 70um(2oz)+plate TOP layer
0.46mm dielectric material
copper ------- 70um(2oz) MidLayer 1
0.36mm dielectric material
copper ------- 70um(2oz) MidLayer 2
0.46mm dielectric material
copper ------- 175um(5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 15mil/17mil
Minimum / Maximum Holes: 0.5/3.251mm
Number of Different Holes: 9
Number of Drill Holes: 3510
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy:  FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:  6oz
Final foil internal:  2oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (12.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Power supply, Led Strip Light
Speaker System
ADSL Modem
VHF Radio
Router Wireless
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.



The components of multilayer PCB: Prepreg
A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.

Prepreg plays a role of bonding material used for bonding the individual thin laminates of the
multilayer boards. It consists of glass cloth impregnated with epoxy resin. Unlike rigid laminates,
the epoxy resin is only semi-cured. Epoxy resin is referred to as B-stage when semi-cured.

The prepreg sheets are not sticky. During lamination of the board, the epoxy resin is first changed
to a liquid state and later in the press cycle to the fully cured state. During the press cycle, the
cured epoxy resin in the thin, rigid laminates softens, but it does not become liquid.

Thicknesses of Prepreg sheets
Glass Fabric Style Pressed Thickness Resin Content
  mm mil %
7628H(7630) 0.213 8.4 50
7628(43%) 0.195 7.6 43
7628(41%) 0.185 7.3 41
2116HR 0.135 5.3 57
2116 0.12 4.7 52
2113 0.1 4 56
1080 0.076 3 64
1060 0.05 2 71

The pressed thickness varies from one manufacturer to another. As long as the PCB designer does
not know the brand(s) of the glass fabrics used by the multilayer board manufacturer, it is more or
less impossible to specify a detailed build-up. Therefore, this should be left to the manufacturer.
When a board is required impedance control, the thickness of the dielectric material between the
individual layers become important and thickness and tolerance are usually specified by designer.

The minimum thickness of the dielectric material (thin laminate or prepreg sheets) is 75 µm (3 mils)
and, in some cases, 100 µm (4 mils).


Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now