Multilayer PCB on 1.6mm Fr4 with 1oz Each Copper Layer

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0365-V3.65
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1oz)
• Inner Iayer Cu Thicknes: 35 Um (1oz)
• Final Height of PCB: 1.6mm +/-0.16
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 7.9 Mil
• Minimum Gap(Mil): 5.5 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 194.40 x 212mm=24UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg135 substrate for the application of Modem
WiFi. It's 1.6 mm thick without silkscreen on black solder mask and immersion gold on pads.
The base material is from ITEQ supplying 24 up boards per panel. They're fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment. 

1.2 Features and benifits    
    
A. It's suitable for handheld and consumer applications.
B. High solderability, no stressing of circuit boards and less contamination of PCB surface.
C. Electrical test and  high voltage test
D. 16000 square meter workshop
E. Diversified shipping method
F. ISO9001, ISO14001, TS16949, UL Certified

1.3 Application
    
GPS Tracker, Circuit Board, Mobile Signal Booster, Lan Hub, IP CCTV, Access Point Wireless,
Cellular Repeater, Alert Systems, Program Logic Control, File servers

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer board
Board Size	194.40 x 212mm=24UP
Board Thickness	1.6mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-S6189BK31
Solder Mask Supplier	KUANGSHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	14 um
Type of Silkscreen Ink	n/a
Supplier of Silkscreen	n/a
Color of Silkscreen	n/a
Number of Silkscreen	n/a
Mininum Trace (mil)	7.9 mil
Minimum Gap(mil)	5.5 mil
Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.25%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 1.500
	T2: 1.525

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