Precision Engineered Timer Circuits and Treadmill Pcbs with Solar Light Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-059-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers RO4730G3 Microwave PCB Board 2-Layer Rogers 4730 30mil 0.762mm Circuit Board DK3.0 DF 0.0028 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General description
This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas. There's no solder mask on both sides and the surface finish is immersion gold on both sides.

Basic specifications
Base material: RO4730G3 30mil (0.762mm)
Dielectric constant: 3.0+/-0.5
Layer count: 2 layers
Type: Through holes
Format: 110mm x 100mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.1 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months



Rogers RO4730G3 High Frequency Material
Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ºC. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

Typical application is cellular base station antennas.

Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property	RO4730G3	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.5	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign	2.98	Z		1.7 GHz to 5 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0028	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5
				2.5 GHz
Thermal Coefficient of ε	+34	Z	ppm/ºC	-50 ºCto 150ºC	IPC-TM-650 2.5.5.5
Dimensional Stability	<0.4	X, Y	mm/m	after etech +E2/150 ºC	IPC-TM-650 2.4.39A
Volume Resistivity (0.030")	9 X 10^7		MΩ.cm	COND A	IPC-TM-650  2.5.17.1
Surface Resistivity (0.030")	7.2 X 10^5		MΩ	COND A	IPC-TM-650  2.5.17.1
PIM	-165		dBc	50 ohm 0.060"	43 dBm 1900 MHz
Electrical Strength (0.030")	730	Z	V/mil		IPC-TM-650  2.5.6.2
Flexural Strength  MD	181 (26.3)		Mpa (kpsi)	RT	ASTM D790
CMD	139 (20.2)
Moisure Absorption	0.093	-	%	48/50	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity	0.45	Z	W/mK	50ºC	ASTM D5470
Coefficient of Thermal Expansion	15.9 14.4 35.2	X Y Z	ppm/ºC	-50 ºCto 288ºC	IPC-TM-650 2.4.4.1
Tg	>280		ºC		IPC-TM-650 2.4.24
Td	411		ºC		ASTM D3850
Density	1.58		gm/cm^3		ASTM D792
Copper Peel Stength	4.1		pli	1oz,LoPro EDC	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes