| Customization: | Available |
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| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the world of flexible electronics, the 4-Layer Multilayer FPC is a versatile and reliable solution designed for applications requiring high-density interconnection and flexibility. Built on polyimide (PI) with 1oz copper on each layer, this flexible printed circuit is coated with a yellow coverlay and features immersion gold on the pads. Designed for wireless routers and other compact electronic devices, this FPC combines excellent flexibility with high reliability, making it ideal for a wide range of applications.
Key Features of 4-Layer Multilayer FPC
1.Excellent Flexibility: The FPC can be bent, folded, and wound, making it ideal for applications where space and flexibility are critical.
2.Reduced Volume and Weight: By using FPC, the overall volume and weight of electronic products can be significantly reduced, enabling the development of smaller and lighter devices.
3.Increased Reliability: The 4-layer structure ensures consistent performance and durability, even in demanding environments.
4.Low Cost: The FPC offers a cost-effective solution for low to medium volume production, making it an economical choice for various applications.
5.Material Optionality: The FPC can be customized with different materials to meet specific application requirements.
6.Engineering Design Support: Our engineering team ensures potential issues are addressed during the pre-production phase, reducing the risk of errors.
Parameter and data sheet
| Size of Flexible PCB | 300.5X 25.5mm |
| Number of Layers | 4 |
| Board Type | Flexible circuits |
| Board Thickness | 0.30mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | NO |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | NO |
| Supplier of Silkscreen | N/A |
| Color of Silkscreen | N/A |
| Number of Silkscreen | N/A |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
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Applications
The 4-Layer Multilayer FPC is well-suited for a variety of applications, including:
Wireless Routers: Ideal for compact and lightweight designs in wireless communication devices.
Laser Head FPC: Ensures reliable performance in laser head applications.
Medical Equipment Controllers: Suitable for flexible and durable designs in medical devices.
Tablet Antenna Soft Boards: Perfect for flexible connections in tablet devices.
Why Choose 4-Layer Multilayer FPC?
Versatility: The FPC can be used in a wide range of applications, from consumer electronics to industrial devices.
High Reliability: Manufactured to IPC 6012 Class 2 standards, the FPC ensures high quality and reliability.
Cost-Effective: The FPC offers a low-cost alternative to traditional rigid PCBs, making it an economical choice for low to medium volume production.
Global Availability: Ready to ship worldwide, ensuring timely delivery for your projects.
Materials and Thicknesses
Dielectric Substrates: 50 µm (2 mil) polyimide for higher stability and easier handling.
Copper Foil: 35 µm (1 oz.) copper foil, compatible with current carrying requirements.
Covercoat: 25 µm (1 mil) polyimide for better encapsulation of conductors.
Adhesive: 25 µm (1 mil) acrylic adhesive for low-flow lamination and reliability.
Processes
The 4-Layer Multilayer FPC is a high-performance, cost-effective solution designed for applications requiring both flexibility and high-density interconnection. With its excellent flexibility, increased reliability, and low cost, it is an ideal choice for engineers working on wireless routers, medical devices, and consumer electronics.
Whether you're designing for compact electronic devices or specialized industrial applications, the 4-Layer Multilayer FPC offers the reliability and performance you need to bring your projects to life.
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