Immersion Gold PCB on 4 Layer Fr-4 Tg135 Big Panel

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0318-V3.18
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Final Foil External
1 Oz
Innner Copper Thick
1 Oz
Final Height of PCB
1.6mm ±0.16
Surface Finish
Immersion Gold 2 Microinch 20% Area
Solder Mask Color
Green
Colour of Component Legend
White
Test
100% Electrical Test Prior Shipment
Minimum Trace and Space
4mil / 4mil
Minimum / Maximum Holes
0.3mm / 5.0mm
Via
Minimum Size 0.3mm
Transport Package
Vacuum
Specification
214 mm x 276mm/8up
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 Tg150 substrate for the
application of Embedded Processor. It's 1.6 mm thick with white silkscreen on green
solder mask and immersion gold on pads. The base material is from ITEQ supplying
8 up boards per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber
data. Each 25 panels are packed for shipment. 

1.2 Features and benifits
    
A. Tg > 150ºC (Mid-Tg)
B. Good oxidation resistance and good heat dissipation.
C. PCB manufacturing on required specifications. 
D. 16000 square meter workshop
E. Quick Lead time: 3-5 days
F. Focus on low to medium volume production
    
1.3 Application
    
Bluetooth Headphones, Solar Battery Charger, Lan Switch, GPS Receiver,Portable Pa
Systems, Bluetooth USB Hub, Embedded Projects, SMS Modem, Access Control Definition,
Telecommunications ,

1.4 Parameter and data sheet
PCB SIZE 214 mm x 276mm/8up
BOARD TYPE Multilayer PCB
Number of Layers 4 layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate Top layer
Prepreg 7628 0.195mm
copper ------- 35um(1oz) MidLayer 1
FR-4 1.2mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz)+plate Bottom layer
TECHNOLOGY  
Minimum Trace and Space: 4mil / 4mil
Minimum / Maximum Holes: 0.3mm / 5.0mm
Number of Different Holes: 6
Number of Drill Holes: 2864
Number of Milled Slots: 0
Number of Internal Cutouts: 9
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg 150 ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion gold 2 microinch 20% area
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green solder mask (Taiyo PSR-2000GT600D)
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White silkscreen (TAIYO IJR-4000 MW300)
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.




 

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