Hybrid PCB Mixed Material PCB Built on 20 Mil RO4350b Plus Fr-4 with Blind Via

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b and Fr-4
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Basic Info.

Model NO.
BIC-046-V46
Material
Hydrocarbon/Woven Glass and Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Glass Reinforced Hydrocarbon and Epoxy Resin
Final Foil External
1 Oz
Final Foil Internal
1 Oz
Board Thickness
1.69 mm ±10%
Surface Finish
Immersion Gold
Solder Mask Color
Green
Colour of Component Legend
White
Minimum Trace and Spac
15mil / 15 Mil
Minimum / Maximum Holes
0.4 mm / 2.5 mm
Via
Blind Via L1-L2, L5-L6, L3-L6
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
99 x 85mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000PCS/Month

Product Description

Brief Introduction
With the development of electronic communication technology, the communication frequency is
becoming higher and higher, and the high frequency signal transmission, need to use low dielectric
constant (Dk), low dielectric loss (Df) but expensive special materials. These materials have cyanate
and high frequency materials such as polytetrafluoroethylene / ceramic based materials
(PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of products.
Therefore, the customers adopt the laminated structure of mixed materials in the design of PCB
structure, that is, the necessary signal layer uses high-frequency materials to meet the needs of
signal transmission. Other line layers are made of conventional fiberglass epoxy FR-4, which we
call a hybrid board.

Available high frequency material (Core)
RO4350B                            RO4003C
4mil (0.1mm)                      8mil (0.203mm)
6.6mil (0.168mm)              12mil (0.3mm)
10mil (0.254mm)               20mil (0.508mm)
13.3mil (0.338mm)           32mil (0.813mm)
20mil (0.508mm)              60mil (1.524mm)
30mil (0.762mm)    
60mil (1.524mm)    



PCB Case: Hybrid PCB | Mixed Material PCB Built On
20 mil RO4350B Plus FR-4 With Blind Via
(Printed circuit boards are custom-made products, the picture and parameters shown are just
for reference)

General description
This is a type of mixed material multilayer PCB built on 20 mil RO4350B plus FR-4 substrate for
the application of satellite antenna. It's 1.69 mm thick, white silkscreen over green solder mask
on both sides and immersion gold is plated on pads and tracks. The base material is used from
Rogers and ITEQ, entire board supplying 1 PCB up. They're fabricated per IPC 6012 Class 2
using supplied Gerber data. Each 25 boards are packed for shipment. 

Features and benefits    
RO4350B exhibits a stable dielectric constant over a broad frequency range;
Excellent high frequency performance due to low dielectric tolerance and loss;
SI performance improvement over the stack-ups with all FR4 board;
Cost reduction over stack-ups with all low loss material;
Long storage time which can be stored for more than 1 year in vacuum bag;
ISO9001, ISO14001, UL certified manufacturing factory;
PCB manufacturing on required specifications;
No MOQ, low cost for prototypes and small runs quantity;
8000 types of PCB per month;


Application
LNA, Radar data acquisition converter,Spread spectrum, 3G antenna


Parameter and data sheet
PCB SIZE 99 x 85mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 6 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper --------18um(0.5 oz)+plate TOP layer
RO4350B 0.508mm
copper ------- 18um(0.5 oz) 
  Prepreg 2313 x 2, 0.2mm
  Copper ------- 35um (1 oz)
  FR-4 0.305mm
  Copper ------- 35um (1 oz)
  Prepreg 2313 x 2, 0.2mm
  Copper ------- 35um (1 oz)
  FR-4 0.305mm
  copper --------18um(0.5 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 15mil / 15 mil
Minimum / Maximum Holes: 0.4 mm / 2.5 mm
Number of Different Holes: 4
Number of Drill Holes: 89
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  RO4350B Tg280ºC, er<3.48, Rogers Corp. IT158 FR-4
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.69 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold 0.053 micron over nickle 4.42 micron
Solder Mask Apply To:  Both sides
Solder Mask Color:  Green, LP-4G/G-05, Nanya
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Top Side
Colour of Component Legend White, S-380W, Taiyo
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
Blind via L1-L2, L5-L6, L3-L6
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


About Us
Bicheng PCB, a unique printed circuit board supplier based in Shenzhen China serves worldwide
customers since it's born in 2003. At Bicheng, every batch of PCB goes through electrical test, AOI
inspection, high voltage test, Impedance control test, micro-section, solder-ability test, thermal stress
test, reliability test, insulation resistance test and ionic contamination test etc. Finally it is like a
beautiful gift to be delivered to your hands.

Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands
HDI board
Heavy copper board
Hybrid material board
Blind via board
High frequency board
Metal core board
Immersion gold board
Multilayer board
Backplane board
Gold finger board

Comprehensive sales service presale, in sale and after sale.
Quick CADCAM checking and free PCB quotation
Free-of-charge PCB panelization
Prototype PCB capability
Volume Production capability
Quick turn-around samples
Free-of-charge PCB test
Solid carton packing

Variety of PCBs



 

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