High Density Multilayer PCB on 1.6mm Fr-4 with 6 Layer Copper Layer

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0424-V4.24
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Cu Thickness
35 Um (1oz)
Final Height of PCB
1.60 mm
Surface Finish
HASL Lead Free
Solder Mask Color
Green
Colour of Component Legend
White
Mininum Trace (Mil)
10 Mil
Minimum Gap(Mil)
5.7 Mil
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
157.48 x 120.49mm=1UP
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 6 layer PCB board built on FR-4 Tg135 substrate for the application of Wireless
HDMI Transmitter. It's 1.6 mm thick with white silkscreen on green solder mask and HASL (pb
free)on pads. The base material is from Shengyi supplying 1 up single board. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benifits    
    
A. Lead free assemblies with a maximum reflow temperature of 260ºC.
B. Excellent wetting during component soldering and it can avoid copper corrosion.
C. Electrical test and  high voltage test
D. Engineering design prevents problems from occurring in pre production. 
E. No minimum order quantity. 1 piece is available.
F. Delivery on time: >98%  

1.3 Application
    
ADSL, Lte Router, Bluetooth Module, Spread Spectrum, Fleet Tracking, Vehicle Tracking
Devices, DC Supply, AC DC Transformer, Bidirectional DC DC Converter, Heart monitors

1.4 Parameter and data sheet
Number of Layers 6
Board Type Multilayer PCB
Board size 157.48 x 120.49mm=1UP
Board Thickness 1.60 mm
Board Material FR-4
Board Material Supplier Shengyi
Tg Value of Board Material 135ºC
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, LP-4G/G-05
Solder Mask Supplier NANYA
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 25.6 um
 
Type of Silkscreen Ink S-380W
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 2
 
Mininum Trace (mil) 10 mil
Minimum Gap(mil) 5.7 mil
 
Surface Finish HASL Lead free
RoHS Required Yes
Warpage 0.23%
Drill table (mm)  
T1 0.812 
T2 0.889 
T3 1.143 
T4 2.311 
T5 2.616 
T6 3.048 
T7 0.500 
T8 2.050 
T9 1.016 
T10 3.505 
   
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. 
No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

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