8 Layer Prototype PCB FR-4 Tg180 Routing 100% passed IPC-A-600H and IPC-6012C with
Immersion Gold in Surveillance Systems
Commodity Introduction
This is a type of FR-4 PCB for the application of Surveillance Systems. It's an 8 layer board at
1.6mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from KUANG SHUN.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 TG180 |
FR-4 TG180 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
1.6+/-10%mm |
1.58-1.64mm |
| Outer copper foil |
>=35 um |
43.37 um |
| Inner copper foil |
1/1 OZ |
1/1 OZ |
| Warp-twist |
<= 0.75% |
0.19% |
| Legend |
Type |
KUANG SHUN |
KUANG SHUN |
| Color |
White |
White |
| Location |
CS |
CS |
| Marking |
Co.logo |
YES |
OK |
| UL.logo |
YES |
OK |
| Date code |
WWYY |
WWYY |
| Marking form |
NA |
OK |
| Location |
CS |
CS |
| Min line width (mil) |
5.4 |
5.2 |
| Min line spacing (mil) |
6 |
6.2 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
KUANG SHUN |
KUANG SHUN |
| Color |
Green |
Green |
| Thickness |
>=10 um |
13 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface treament |
ENIG |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012C |
OK |
| Solderability Test |
245ºC 5S 1 Cycle |
OK |
Finished dimension (unit: mm): including v-cut
| NO |
Required Dimension (tolerance) |
Actual dimension |
| 1 |
125.00 |
124.94 |
124.93 |
124.91 |
124.89 |
| 2 |
126.00 |
125.89 |
125.94 |
125.93 |
126.02 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| NO |
Required |
PTH |
Actual dimension |
| 1 |
0.750 |
Y |
0.750 |
0.725 |
0.775 |
0.750 |
| 2 |
2.200 |
N |
2.200 |
2.175 |
2.225 |
2.200 |
| 3 |
2.250 |
N |
2.250 |
2.225 |
2.275 |
2.250 |
Learn PCB and Buy PCB----ENIG
ENIG stands for Electroless nickel immersion gold which is a type of surface plating used for circuit
boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold.
Normally, the thickness of nickel is 120µ" - 200µ" (3µm to 5µm ) and gold 1-5µ" (0.025µm
- 0.127µm).
ENIG has several advantages than HASL, including
a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP
mounted components to reduce failure rate during assembly and soldering.
b) Good oxidation resistance and good heat dissipation.
c) Long storage time (It can be stored for more than 1 year in vacuum bag)
d) High solderability, no stressing of circuit boards and less contamination of PCB surface.
e) SMT process is resistant to reflow soldering, resistant to rework.
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