Multilayer PCB 2.0mm Thick Fr-4 with Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0332-V3.32
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 35 Um (1 Oz)
• Inner Iayer Cu Thicknes: 35 Um (1 Oz)
• Final Height of PCB: 2.0mm +/-0.2
• Surface Finish: Immersion Gold
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 7 Mil
• Minimum Gap(Mil): 5 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 214 x 182mm=16UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layers PCB board built on FR-4 Tg135 substrate for the application
of bluetooth adapter. It's 2.0 mm thick with white silkscreen on green solder mask and
immersion gold on pads. The base material is from ITEQ supplying 16 up boards per
panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20
panels are packed for shipment. 

1.2 Features and benifits    
    
A. It's suitable for handheld and consumer applications.
B. SMT process is resistant to reflow soldering, resistant to rework.
C. 16000 square meter workshop
D. Comprehensive equipment management and maintenance and process control
E. Professional and experienced engineers
F. No MOQ, low cost for prototypes and small runs quantity. 

1.3 Application
    
Bluetooth Headset, Pos System, 3G Modem, Wireless Modems, Inverter Circuit, Car
Tracking System, Linux Embedded, Door Access Control Systems, Wireless Antennas,
LCD Panels

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB, 4 Layers
Board Size	214 x 182mm=16UP
Board Thickness	2.0mm +/-0.2
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Mininum Trace (mil)	7 mil
Minimum Gap(mil)	5 mil
Surface Finish	Immersion gold, 0.05 micron gold over  4.13 micron nickel
RoHS Required	Yes
Warpage	0.23%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.7
	T2: 0.9
	T3: 1.3
	T4: 5.0
	T5: 3.8