| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Kappa 438 |
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| PCB Capability (Kappa 438) | |
| PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
| Designation: | Kappa 438 |
| Dielectric constant: | 4.38 at 2.5GHz |
| Layer count: | Single Layer, Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35 µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
| Property | Typical Value Kappa 438 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Design | 4.38 | Z | - | 2.5 GHz | Differential Phase Length Method |
| Dissipation Factor tan, d | 0.005 | Z | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant e | -21 | - | ppm/°C | 10 GHz (-50 to 150°C) | Modified IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2.9 x 109 | - | M•cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 6.2 x 107 | - | M | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 675 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
| Tensile Strength | 16 12 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flexural Strength | 25 19 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Dimensional Stability | -0.48-0.59 | MD CMD | mm/m | - | IPC-TM-650 2.4.39a |
| Coefficient of Thermal Expansion | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| 16 | Y | ||||
| 42 | Z | ||||
| Thermal Conductivity | 0.64 | Z | W/(m.K) | 80°C | ASTM D5470 |
| Time to Delamination (T288) | >60 | - | minutes | 288°C | IPC-TM-650 2.4.24.1 |
| Tg | >280 | - | °C TMA | - | IPC-TM-650 2.4.24.3 |
| Td | 414 | - | °C | - | IPC-TM-650 2.3.40 |
| Moisture Absorption | 0.07 | - | % | 24/23 | IPC-TM-650 2.6.2.1 |
| Young's Modulus | 2264 2098 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flex Modulus | 2337 2123 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Bow | 0.03 | - | % | - | IPC-TM-650 2.4.22C |
| Twist | 0.08 | - | % | - | IPC-TM-650 2.4.22C |
| Copper Peel Strength After Thermal Stress | 5.8 | - | lbs/in | 1 oz (35 µm) foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Specific Gravity | 1.99 | - | g/cm3 | - | ASTM D792 |
| Lead-Free Process Compatible | Yes | - | - | - |
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