Multilayer PCB Fr4 with Black Color and Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0334-V3.34
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 35 Um (1 Oz)
• Final Height of PCB: 1.60±10%mm
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: White
• Mininum Trace (Mil): 7.6 Mil
• Minimum Gap(Mil): 5 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 86.03 X 184.53mm=4up
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg170 substrate for the application
of radar detector. It's 1.6 mm thick with white silkscreen on black solder mask and
immersion gold on pads. The base material is from ITEQ supplying 4 up boards per
panel. Thye're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25
panels are packed for shipment. 

1.2 Features and benifits    
    
A. Industrial standard material with high Tg (175ºC by DSC) and  excellent thermal
     reliability. 
B. Excellent surface planarity for CSP mounted components to reduce failure rate during
     assembly and soldering.
C. AOI inspection
D. Reliability test, insulation resistance test and ionic contamination test
E. 12 hours quotation
F. No minimum order quantity and low cost sample.

1.3 Application
    
Led Lights, Led Driver,GSM Alarm, Cable Router, AC Inverter, Led Light Kits,PLC Tutorial,
Access Controller USB Wireless Modem, Relays (automotive and industrial)

1.4 Parameter and data sheet

Item	Description	Content
Layer count	4 Layer PCB	4 Layer PCB board
Board type	Multilayer PCB	Multilayer PCB
Board size	86.03 X 184.53mm=4up	86.03 X 184.53mm=4up
Laminate	Type	FR-4  TG170
	Supplier	ITEQ
	Board thickness	1.60±10%mm
	Outer copper foil	>=35 um
	Inner copper foil	/
	Warp-twist	<= 0.75%
Legend	Type	KUANG SHUN
	Color	White
	Location	CS & SS
Marking	Co.logo	YES
	UL.logo	YES
	Date code	WWYY
	Marking form	NA
	Location	CS
Min line width (mil)	7.6	7.6
Min line spacing (mil)	5	5
Min ring width (mil)	NA	NA
Solder Mask	Type	KSM-S6189BK31
	Color	Black
	Thickness	>=10 um
	Pencil Test	6H OR ABOVE
	SOLVENT TEST	NO ATTACK
	TAPE TEST	NO PEEL OFF
Surface Treament	Immersion Gold
Special Treament	Silk screen	/
	Location	/
	Forming	V-cut
Normal Testing	Electrical test	100% PCB passed
	Visual inspection	IPC-A-600H&IPC-6012B
	Solderability Test	245ºC 5S 1 Cycle
Drill table (mm)	T1	1.000±0.076
	T2	1.700±0.076
	T3	3.000±0.05