| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Aluminum Nitride (Aln) |
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(Note: PCBs are custom-made products; images and specifications provided are for reference only.)
Brief Introduction
The AlN ceramic PCB features a complex 6-layer design using aluminum nitride (AlN) as the substrate. Known for its exceptional thermal conductivity and electrical insulation, this material facilitates efficient heat dissipation. The board has a finished thickness of 1.5mm, with both inner and outer layers composed of 1oz finished copper. The PCB is free from solder masks and silkscreen characters, and utilizes a 2 micro-inch immersion gold surface finish, manufactured according to IPC-Class-2 standards.
Basic Specifications
Board Dimensions: 51 mm x 52 mm (1 piece, +/- 0.15mm)
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.4mm
Blind Vias: None
Finished Board Thickness: 1.5mm +/- 10%
Finished Copper Weight: 1oz (1.4 mils) on outer layers
Via Plating Thickness: 20 μm
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Electrical Testing: 100% electrical test prior to shipment
Introduction to AlN Ceramic Substrates
Aluminum Nitride Ceramic Copper Clad Laminate (commonly known as AlN copper clad laminate) is a specialized electronic material that combines aluminum nitride (AlN) ceramic with a high-purity copper layer. This combination delivers ultra-high thermal conductivity and excellent electrical insulation, making it a core material for high-power electronic devices, high-frequency communications, and new energy vehicles. It is recognized as a leading solution for heat dissipation challenges in the electronics industry.
PCB Specifications
| PCB SIZE | 51 x 52mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided Ceramic PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz) |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| ----Prepreg---- | |
| copper ------- 35um(1oz) | |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| ----Prepreg---- | |
| copper ------- 35um(1oz) | |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil / 5mil |
| Minimum / Maximum Holes: | 0.4mm / 1.0mm |
| Number of Different Holes: | 8 |
| Number of Drill Holes: | 31 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | AIN Ceramic |
| Final foil external: | 1.0 oz |
| Final foil internal: | 1.0 oz |
| Final height of PCB: | 1.5 mm ±0.15mm |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCB.DOC etc |
| SERVICE AREA | Worldwide, Globally. |
Features & Benefits
1.Ultra-High Thermal Conductivity Performance:
AlN boasts thermal conductivity of 170-200 W/(m·K), significantly surpassing traditional aluminum oxide ceramics. This property allows rapid heat transfer from electronic components, lowering junction temperatures and enhancing reliability.
2.Low Coefficient of Thermal Expansion:
With a coefficient of thermal expansion of 4.5×10-6/°C, AlN closely matches that of semiconductor materials, reducing the risk of thermal stress cracking
3.Excellent Electrical Insulation:
AlN features low dielectric constants (8.8-9.5) and low dielectric loss (<0.001), making it ideal for high-frequency applications such as 5G technologies.
4.High Mechanical Strength and Corrosion Resistance:
The high hardness and chemical stability of AlN ensure durability, while advanced copper cladding processes provide robust bonding and resistance to harsh environments.
Data Sheets
| 1.Ceramic Parameters | |||
| Items | Unit | Al2O3 | Si3N4 |
| Density | g/cm3 | ≥3.3 | ≥3.22 |
| Roughness (Ra) | μm | ≤0.6 | ≤0.7 |
| Bending strength | Mpa | ≥450 | ≥700 |
| Coefficient of thermal expansion | 10^-6/K | 4.6~5.2 (40-400ºC) | 2.5~3.1 (40-400ºC) |
| Thermal conductivity | W/(m*K) | ≥170 (25ºC) | 80 (25ºC) |
| Dielectric constant | 1MHz | 9 | 9 |
| Dielectric loss | 1MHz | 2*10^-4 | 2*10^-4 |
| Volume resistivity | Ω*cm | >10^14 (25ºC) | >10^14 (25ºC) |
| Dielectric strength | kV/mm | >20 | >15 |
| 2. Material Thickness | ||||||
| Copper Thickness | ||||||
| 0.15mm | 0.25mm | 0.30mm | 0.50mm | 0.8mm | ||
| Ceramic Thickness | 0.25mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | - |
| 0.32mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | Si3N4 | |
| 0.38mm | AlN | AlN | AlN | - | - | |
| 0.50mm | AlN | AlN | AlN | - | - | |
| 0.63mm | AlN | AlN | AlN | - | - | |
| 1.00mm | AlN | AlN | AlN | - | - | |
Typical Applications
Electric Vehicle Inverters: Utilizing a 1mm AlN substrate improves energy efficiency and extends the lifespan of IGBT modules.
GaN Power Amplifier Modules in 5G Base Stations: AlN solves high-frequency heat issues, ensuring stable signal transmission.
Industrial Laser Cutting Machines: Used for cooling CO2 laser circuits, preventing temperature-induced beam drift.
Future Trends
As third-generation semiconductors (SiC, GaN) become more prevalent, the demand for efficient heat dissipation in high-power devices will increase. AlN ceramic PCBs are poised to expand in new energy sectors, artificial intelligence applications, and 6G communication technologies.
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