Immersoin Gold PCB on 4 Layer Copper with Blind Via

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0046-V4.6
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Cu Thickness
1 Oz
Final Foil Internal
0.5 Oz
Final Height of PCB
1.6mm ±0.16
Surface Finish
Immersion Gold
Solder Mask Color
Green
Colour of Component Legend
White
Minimum Trace and Space
6.7 Mil/5.9 Mil
Minimum / Maximum Holes
0.3/2.5mm
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
230 x 209mm=48PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 substrate with Tg 170°C  for the
application of Microcontroller. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder
mask (Nanya) and immersion gold on pads. The base material is from Taiwan ITEQ supplying
48 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 25 panels are packed for shipment.

1.2 Features and benifits    
    
A. Lead-Free Assembly Compatible
B. Long storage time (It can be stored for more than 1 year in vacuum bag)
C. Impedance control test and solder-ability test
D. Quick CADCAM checking and free PCB quotation
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user

1.3 Application
    
GPRS,VHF Radio,Car Tracking Device,Communication Systems,Electric Converter,Inverter
Solar,PLC Ladder Logic,HSDPA USB Modem,3G Wireless Modem,Automobile  

1.4 Parameter and data sheet
PCB SIZE 230 x 209mm=48PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
Prepreg 7628(43%) 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628(43%) 0.195mm
copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 6.7mil/5.9mil
Minimum / Maximum Holes: 0.3/2.5mm
Number of Different Holes: 13
Number of Drill Holes: 2512
Number of Milled Slots: 144
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy:  FR-4, ITEQ IT-180 TG>170°C, er<5.4
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (31.3%) 2 micoinch over 
100 microinch nickel
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Blind 
via from to inner layer 1
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


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