RO4360g2 Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-119-V2.1
• Material: Hydrocarbon Ceramic-Filled Thermoset Materials
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Application: Radar
• Thickness: 60 Mil
• Layer Count: 2-Layer
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

60mil Double Sided Rogers RO4360G2 Radio Frequency PCB for Ground-based Radar
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


RO4360G2 laminates from Rogers Corporation are thermoset materials featuring glass reinforcement and hydrocarbon ceramic filling. Their dielectric constant stands at 6.15, and they are known for low loss. These laminates offer an optimal blend of performance and simplicity in processing. They expand Rogers' high - end material range as they are lead - free process - capable and provide greater rigidity, which is beneficial for multi - layer board fabrication, thus reducing material and manufacturing expenses.


The processing of RO4360G2 laminates is akin to that of FR - 4, and they are amenable to automated assembly. Their low Z - axis CTE offers design versatility, and they share the same high Tg as the entire RO4000 product line. In multi - layer setups, RO4360G2 laminates can be used in conjunction with RO4450F prepreg and RO4000 laminates with lower Dk values.

Thanks to their Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates allow designers to downsize circuit dimensions in applications where size and cost constraints are crucial. For engineers engaged in designing power amplifiers, patch antennas, ground - based radar, and other general RF applications, these laminates represent the best value option.

Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,

2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible

3. Environmentally friendly
1.) Lead free process compatible

4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain
 

Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
 

PCB Capability (RO4360G2)

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property	RO4360G2	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.15	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
				2.5 GHz/23ºC
Dissipation Factor,tanδ	0.0038	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Conductivity	0.75		W/mK	50ºC	ASTM D-5470
Volume Resistivity	4.0 X 1013		Ω.cm	Elevated T	IPC-TM-650  2.5.17.1
Surface Resistivity	9.0 X 1012		Ω	Elevated T	IPC-TM-650  2.5.17.1
Electrical Strength	784	Z	V/mil		IPC-TM-650  2.5.6.2
Tensile Strength	131 (19)     97(14)	X                 Y	MPa (kpsi)	40 hrs 50%RH/23	ASTM D638
Flexural Strength	213(31)     145(21)	X                 Y	Mpa (kpsi)	40 hrs 50%RH/23	IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion	13                     14                              28	X                      Y                         Z	ppm/ºC	-50 ºCto 288ºC  After Replicated Heat Cycle	IPC-TM-650, 2.1.41
Tg	>280		ºC TMA		IPC-TM-650 2.4.24.3
Td	407		ºC		ASTM D3850 using TGA
T288	>30	Z	min	30 min / 125ºC Prebake	IPC-TM-650 2.2.24.1
Moisure Absorption	0.08		%	50ºC/48hr	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er	-131 @10 GHz	Z	ppm/ºC	-50ºC to 150 ºC	IPC-TM-650, 2.5.5.5
Density	2.16		gm/cm3	RT	ASTM D792
Copper Peel Stength	5.2 (0.91)		pli (N/mm)	Condtion B	IPC-TM-650 2.4.8
Flammability	V-0				UL 94 File QMTS2. E102765