Rogers Tmm10 Microwave PCB Board at Low Electronic Components Price

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-149-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 25mil
• Layer Count: 2-Layer
• Application: Stripline and Microstrip
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers 25mil TMM10 Microwave PCBs Chemical Gold and Green Solder Mask for Dielectric Polarizers and Lenses
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Rogers' TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites. They are engineered for high-reliability stripline and microstrip applications with plated-thru-holes.


TMM10 laminates blend the advantages of ceramic and traditional PTFE microwave circuit laminates in terms of electrical and mechanical properties. Notably, it doesn't demand the specialized production techniques usually associated with such materials.

These laminates feature an extremely low thermal coefficient of dielectric constant, usually under 30 ppm/°C. Their isotropic coefficients of thermal expansion, which closely match those of copper, enable the production of highly reliable plated through holes and low etch shrinkage values. Additionally, the thermal conductivity of TMM10 laminates is roughly double that of traditional PTFE/ceramic laminates, which helps with heat dissipation.
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Since TMM10 laminates are made of thermoset resins and don't soften upon heating, wire bonding of component leads to circuit traces can be carried out without worries about pad lifting or substrate deformation.
 

Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems


Our PCB Capabilities (TMM10)  

PCB Capability (TMM10)
PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10
Dielectric constant:	9.20 ±0.23
Layer count:	Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc..

Data Sheet of TMM10 

TMM10 Typical Value
Property		TMM10	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.20±0.23	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.8	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.0022	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-38	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		285	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		21	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		21	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		13.62	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.79	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.09	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.2
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.74	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-