2.0mm 4 Layer PCB on Fr-4 with Black Solder Mask

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0439-V4.39
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 42.81 Um (1.22oz)
• Inner Iayer Cu Thicknes: 35 Um (1oz)
• Final Height of PCB: 2.0 mm
• Surface Finish: Immersion Gold
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 7.2 Mil
• Minimum Gap(Mil): 4.8 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 234 x 168mm=16UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 Tg150 substrate for the application
of Wireless Booster. It's 2.0 mm thick with white silkscreen on green solder mask and immersion
gold on pads. The base material is from ITEQ supplying 16 up boards per panel. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

1.2 Features and benifits    
    
A. Tg > 150ºC (Mid-Tg)
B. High solderability, no stressing of circuit boards and less contamination of PCB surface.
C. Powerful PCB capabilities support your reaearch and development, sales and marketing.
D. Engineering design prevents problems from occurring in pre production. 
E. Quick Lead time: 3-5 days
F. IPC Class 2 / IPC Class 3

1.3 Application
    
Antenna, Multiplexer, AC/DC Adapter, Wireless Alarm, Led Light Fittings, Peripheral Device,
Three Phase Inverter, RF Amplifiers, Balanced Amplifier, Nuclear detection systems

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board size	234 x 168mm=16UP
Board Thickness	2.0 mm
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	150ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	42.81 um (1.22oz)
Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2
Mininum Trace (mil)	7.2 mil
Minimum Gap(mil)	4.8 mil
Surface Finish	Immersion Gold
RoHS Required	Yes
Warpage	0.54%
Drill table (mm)
T1	0.900
T2	4.000
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2

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