| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| PCB SIZE | 35 x 51mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| TMM3 0.508mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.40 mm / 2.50 mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 3 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | no |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | TMM3 0.508mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.68 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold, 99% |
| Solder Mask Apply To: | Top Layer |
| Solder Mask Color: | Green |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.40mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| PCB Capability (TMM3) | |
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM3 |
| Dielectric constant: | 3.27 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.. |
| TMM3 Typical Value | ||||||
| Property | TMM3 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 3.27±0.032 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | +37 | - | ppm/°K | -55ºC-125ºC | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 109 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | >9x 10^9 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 441 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ºCTGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 15 | X | ppm/K | 0 to 140 ºC | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 15 | Y | ppm/K | 0 to 140 ºC | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 23 | Z | ppm/K | 0 to 140 ºC | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ºC | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 16.53 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.72 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.12 | |||||
| Specific Gravity | 1.78 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.87 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
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