Double Sided PCB Circuit on 1.0mm Fr-4 in Lyriform

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0443-V4.43
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1oz)
• Final Height of PCB: 1.0 mm +/-0.1
• Surface Finish: HASL Lead Free
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 9.6 Mil
• Minimum Gap(Mil): 5.9 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 251.99 x 218.50mm=1UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer PCB board built on FR-4 Tg150 substrate for the application of LED
lighting. It's 1.0 mm thick with white silkscreen on black solder mask and HASL lead free on
pads. The base material is from ITEQ supplying 1 up single board. They're fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benifits    
    
A. Lead free assemblies with a maximum reflow temperature of 260ºC.
B. Excellent wetting during component soldering and it can avoid copper corrosion.
C. ISO9001, ISO14001, UL certified manufacturing factory.
D. 30000 square meter month capability
E. Eligible products rate of first production: >95%  
F. Free stencil shim sent for new user

1.3 Application
    
Remote Control, Portable Pa System, Wireless USB Hub, Wireless Signal Booster, DC AC
Inverter, AC Converter, Led Lighting Systems, Lenel Access Control, Accesscontrol, Control
relays

1.4 Parameter and data sheet

Number of Layers	2
Board size	251.99 x 218.50mm=1UP
Board Type	Double Sided PCB
Board Thickness	1.0 mm +/-0.1
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	150ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-S6189BK31
Solder Mask Supplier	KUANG SHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	N/A
Supplier of Silkscreen	N/A
Color of Silkscreen	N/A
Number of Silkscreen	N/A
Mininum Trace (mil)	9.6 mil
Minimum Gap(mil)	5.9 mil
Surface Finish	HASL Lead Free
RoHS Required	Yes
Warpage	0.25%
Drill table (mm)
T1	0.700
T2	0.750
T3	2.000
T4	4.800
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2

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