| Customization: | Available |
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| Type: | Rigid-Flexible PCB |
| Dielectric: | Polyimide (Pi) |
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Introducing Our 8-Layer Rigid-Flex PCB for Car Tracker GPS
We are proud to present our advanced 8-layer rigid-flex printed circuit board (PCB), meticulously designed for car tracker GPS applications. This PCB features a thickness of 2.0mm for the rigid portions and 0.24mm for the flexible sections. With half-ounce copper on the inner layers and one ounce on the outer layers, this design ensures optimal performance and efficiency. Impedance control is implemented in the inner flexible circuit, and immersion gold plating is provided on the pads to support reliable surface mount technology (SMT) assembly.
| Size of Flex-Rigid PCB | 137mm x 178mm=1 PCS | ||
| Number of Layers | 8 | ||
| Board Type | Rigid-Flex PCB | ||
| Board Thickness | 2.0mm -Rigid, 0.24mm - flex | ||
| Board Material | FR-4 / Polyimide 3mil | ||
| Board Material Supplier | Shengyi / Panasonic | ||
| Tg Value of Board Material | 170ºC | ||
| PTH Cu thickness | ≥20 µm | ||
| Inner Iayer Cu thicknes | 18 µm | ||
| Surface Cu thickness | 35 µm | ||
| Coverlay Colour | Yellow coverlay / Green solder mask | ||
| Number of Coverlay | 2 | ||
| Thickness of Coverlay | 25 µm | ||
| Stiffener Material | N/A | ||
| Stiffener Thickness | N/A | ||
| Type of Silkscreen Ink | IJR-4000 MW300 | ||
| Supplier of Silkscreen | TAIYO | ||
| Color of Silkscreen | White | ||
| Number of Silkscreen | 1 | ||
| Peeling test of Coverlay | No peelable | ||
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test | ||
| Surface Finish | Immersion Gold | ||
| Thickness of Surface Finish | Au: 0.03µm(Min.); Ni 2-4µm | ||
| RoHS Required | Yes | ||
| Famability | 94-V0 | ||
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. | ||
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. | ||
| Function | 100% Pass electrical test | ||
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 | ||
| Stack-up | Top Layer | ||
| Inner layer 1 | |||
| Inner layer 2 | |||
| Inner layer 3 | |||
| Inner layer 4 - inner flexible layer | |||
| Inner layer 5 - inner flexible layer | |||
| Inner layer 6 | |||
| Bottom layer | |||
| Impedance | Controlled layer | Referece layer | Trace lines |
| 50 ohm±10% | Top Layer | IN1 | 0.15mm |
| IN4 | IN3/IN4 | ||
| IN4 (Flex part) | IN5 (Flex part) | ||
| BOT | IN6 | ||
| 80 ohm±10% | TOP | IN1 | 0.16mm/0.16mm |
| IN4 | IN3/IN5 | 0.19mm/0.16mm | |
| BOT | IN6 | 0.16mm/0.16mm | |
Key Features and Advantages
High-Quality Construction: Our rigid-flex PCBs utilize premium laminates from Shengyi and Thinflex, fabricated according to IPC 6012 Class 2 standards using supplied Gerber data.
Excellent Impedance Control: Designed for optimal signal integrity, especially crucial for applications involving high-frequency signals.
Superior Flexibility: The flexible section allows for intricate routing and adaptability in various applications.
Durability: Constructed with high-Tg substrates for enhanced heat resistance and longevity.
Cost-Effective Solutions: We offer competitive pricing with no minimum order quantities, making it accessible for projects of all sizes.
Timely Delivery: Our commitment to punctuality is reflected in our impressive on-time delivery rate of over 98%.
Applications
Our versatile 8-layer rigid-flex PCBs are suitable for a variety of applications, including:
Contact belts for inkjet printers
Industrial surveying and mapping instruments
Tablet PC camera soft boards
Manufacturing Processes
Advanced Equipment
We utilize high-precision manufacturing equipment to ensure the accuracy of our rigid-flex PCBs. This includes advanced drilling machines for via holes and precise lamination equipment to properly bond the rigid and flexible layers.
Quality Control
Our strict quality control procedures include multiple inspections throughout the production process, such as visual inspections for defects and electrical testing to ensure that conductivity and impedance values meet required specifications.
Material Selection
High-Quality Materials: We source top-grade materials for both the rigid and flexible components. The rigid parts utilize high-Tg substrates for better heat resistance, while the flexible sections are made from materials that offer exceptional flexibility and durability.
Material Compatibility: We ensure that the materials used for the rigid and flexible sections are chemically and mechanically compatible, preventing issues such as delamination over time.
Flexibility and Versatility
Suitable for Diverse Industries: Our PCBs can cater to a wide range of applications across various sectors, including aerospace, medical devices, and consumer electronics. In aerospace, for instance, rigid-flex PCBs are ideal for flight control systems due to their space-efficient design and ability to withstand vibrations.
Complex Geometries: We are capable of manufacturing PCBs with intricate shapes and contours, enabling creative and space-efficient designs, such as those required in miniature cameras.
Explore the possibilities with our 8-layer rigid-flex PCBs, engineered for high performance and reliability in car tracker GPS applications. For more information or to discuss your specific needs, please contact us!
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