Laser SMT Stencil Made 0.12mm Stainless Steel Foil with Aluminum Frame

Product Details
Customization: Available
Metal Coating: Tin
Mode of Production: SMT
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Basic Info.

Model NO.
BIC-0056-V5.6
Layers
Double-Layer
Base Material
Stainless Steel Shim
Certification
RoHS, ISO
Customized
Customized
Condition
New
Foil Thickness
0.12mm
Structure
Stencil Foils with Aluminum Frame
Board Material
Stainless Steel Shim
Aperture
Laser Cut
Appearance
Engraving and Electro Polishing
Fiducial Mark
Through Hole
Application
Csp, BGA, 0.5mm Qfp etc. Package
Transport Package
Vacuum
Specification
520 mm x 420 mm x 20mm =1 PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
7314200000
Production Capacity
50000 PCS/ Month

Product Description

Product profile

1.1 General description

This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 520 mm
x 420 mm x 20mm dimension. It's fabricated per IPC 7525A using supplied Gerber data,
squeegee area locating in the center.Fiducal marks are through holes to suit for the SMT
machine. It's packed with KK carton (hard card) and usually 2 stencils are packed for
shipment.

1.2 Features and benifits    
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error
     is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to the printing
     and forming of tin paste;
D. Quick and on-time delivery;
E. Great customer service;
F.  Diversified shipping method;
G. No MOQ, low cost for prototypes and small runs quantity;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip

1.4 Parameter and data sheet
Dimension: 520 x 420 mm =1 PCS
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.12mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1254
Advantages: a) High precision dimension; b) Good shape on the window; 
c) Hole wall is smoother.
Application: CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil
Component 
Type
Pitch Soldering Width Soldering 
Length
Opening 
Width
Opening 
Length
Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402   0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201   0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm   0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm   0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm   0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm




 

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