4 Layer Hybrid PCB on RO4003c + RO4450b + Fr4 Combined

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4003c and Fr-4
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Basic Info.

Model NO.
BIC-034-V34
Material
Hydrocarbon/Woven Glass and Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Glass Reinforced Hydrocarbon and Epoxy Resin
Final Foil External
1 Oz
Final Foil Internal
1 Oz
Board Thickness
1.0mm ±10%
Surface Finish
HASL Lead Free
Solder Mask Color
No
Colour of Component Legend
No
Minimum Trace and Spac
5 Mil/6 Mil
Minimum / Maximum Holes
0.3/5.5mm
Via
Plated Through Hole(Pth)
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
76 x 41mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
5834009000
Production Capacity
50000PCS/Month

Product Description

Brief Introduction
With the development of electronic communication technology, the communication frequency
is becoming higher and higher, and the high frequency signal transmission, need to use low
dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. These materials
have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
products. Therefore, the customers adopt the laminated structure of mixed materials in the
design of PCB structure, that is, the necessary signal layer uses high-frequency materials
to meet the needs of signal transmission. Other line layers are made of conventional fiberglass
epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350B                      RO4003C
4mil (0.1mm)                 8mil (0.203mm)
6.6mil (0.168mm)         12mil (0.3mm)
10mil (0.254mm)          20mil (0.508mm)
13.3mil (0.338mm)       32mil (0.813mm)
20mil (0.508mm)          60mil (1.524mm)
30mil (0.762mm)    
60mil (1.524mm)    


PCB Case: 4 Layer Hybrid PCB on RO4003C + RO4450F
+ FR4 Combined
(Printed circuit boards are custom-made products, the picture and parameters shown are
just for reference)

General description
This is a type of high frequency PCB built on RO4003C and FR-4 combined for the application
of modular oscilloscope. It's a 4 layer RF PCB board at 1.0 mm thick. It's HASL finish without
solder mask. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards
are packed for shipment. 


Features and benefits
Heat resistance, chemical resistance, impact strength and peeling strength are good.
Excellent high frequency performance due to low dielectric tolerance and loss.
Excellent dimensional stability.
ENIG has good oxidation resistance and good heat dissipation.
Help you focus on your core competencies on research and development, sales and
marketing.
Whole fabrication processes are totally controlled. 
No MOQ, low cost for prototypes and samples. 
Eligible products rate of first production: >95%  
UL recognized and RoHS Directive-compliant

Application
Satellite antenna, Antenna combiner, Power amplifier, Multicoupler

Parameter and data sheet
PCB SIZE 76 x 41mm=1PCS
BOARD TYPE Hybrid PCB
Number of Layers Multilayer PCB, 4 layer PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
RO4003C 0.305mm (12mil)
copper ------- 35um(1oz) MidLayer 1
RO4450F 0.101mm
copper ------- 35um(1oz) MidLayer 2
FR-4 0.25mm
copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5mil/6mil
Minimum / Maximum Holes: 0.3/5.5mm
Number of Different Holes: 7
Number of Drill Holes: 491
Number of Milled Slots: 0
Number of Internal Cutouts: 2
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  RO4003C 0.305mm (12mil) and FR-4 0.25mm combined
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.0mm ±0.1
PLATING AND COATING  
Surface Finish HASL Lead free
Solder Mask Apply To:  Not applicable
Solder Mask Color:  NO
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Not applicable
Colour of Component Legend NO
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), via open
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


About Us
Bicheng PCB, a unique printed circuit board supplier based in Shenzhen China serves worldwide
customers since it's born in 2003. At Bicheng, every batch of PCB goes through electrical test,
AOI inspection, high voltage test, Impedance control test, micro-section, solder-ability test,
thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
Finally it is like a beautiful gift to be delivered to your hands.

Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands
HDI board
Heavy copper board
Hybrid material board
Blind via board
High frequency board
Metal core board
Immersion gold board
Multilayer board
Backplane board
Gold finger board

Comprehensive sales service presale, in sale and after sale.
Quick CADCAM checking and free PCB quotation
Free-of-charge PCB panelization
Prototype PCB capability
Volume Production capability
Quick turn-around samples
Free-of-charge PCB test
Solid carton packing


Variety of PCBs


 

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