Complete Audio PCB Services - Taconic RF-35tc RF Boards, Manufacturing & Packaged Assembly

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: AIN
• Model NO.: BIC-029-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Taconic RF-35TC High Frequency Printed Circuit Board 10mil 0.254mm RF-35TC Microwave PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

The RF-35TC laminates are ideal for antennas, satellites, filters, couplers and power amplifiers.



PCB Specifications

PCB SIZE	75 x 86mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	Copper ------- 35um(1 oz)+plate TOP layer
	RF-35TC 0.254mm
	Copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7.1 mil / 5 mil
Minimum / Maximum Holes:	0.4 mm / 5.2 mm
Number of Different Holes:	6
Number of Drill Holes:	41
Number of Milled Slots:	0
Number of Internal Cutouts:	3
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RF-35TC 0.254mm
Final foil external:	1.5 oz
Final foil internal:	N/A
Final height of PCB:	0.3 mm ±0.1mm
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	TOP, 12micron Minimum
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of RF-35TC 

RF-35TC TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5.1(modified)		3.5		3.5
Tck(-30 to 120ºC)	IPC-650 2.5.5.5.1(modified)	ppm	24	ppm	24
Df at 10 GHz	IPC-650 2.5.5.5.1(modified)		0.0011		0.0011
Dielectric Breakdown	IPC-650 2.5.6(in-Plane,Two Pins in Oil)	kV	56.7	kV	56.7
Dielectric Strength	ASTM D 149(Through Plane)	V/mil	570	V/mm	22,441
Arc Resistance	IPC-650 2.5.1	Seconds	304	Seconds	304
Moisture Absorption	IPC-650 2.6.2.1	%	0.05	%	0.05
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	12,900	N/mm^2	88.94
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	11,700	N/mm^2	80.67
Tensile Strength(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	9,020	N/mm^2	62.19
Tensile Strength(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	7,740	N/mm^2	53.37
Elongation at Break(MD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.89	N/mm	1.89
Elongation at Break(CD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.7	%	1.7
Young's Modulus(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	667,000	N/mm^2	4,599
Young's Modulus(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	637,000	N/mm^2	4,392
Poisson's Ratio(MD)	ASTM D 3039/IPC-TM-650 2.4.19		0.18		0.18
Poisson's Ratio(CD)	ASTM D 3039/IPC-TM-650 2.4.19		0.23		0.18
Compressive Modulus	ASTM D 695(23ºC)	psi	560,000	N/mm^2	3,861
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	1.46 x 10^6	N/mm^2	10,309
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	1.50 x 10^6	N/mm^2	10,076
Peel Stength(½ oz.CVH)	IPC-650 2.4.8(Thermal Stress.)	Ibs./inch	7	g/cm^3	1.25
Thermal Conductivity(Unclad,125ºC)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.6	W/(mK)	0.6
Thermal Conductivity(C1/C1,125ºC)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.92	W/(mK)	0.92
Thermal Conductivity(CH/CH,125ºC)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.87	W/(mK)	0.87
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.23	mm/M	0.23
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.64	mm/M	0.64
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	-0.04	mm/M	-0.04
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.46	mm/M	0.46
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	8.33 x 10^7	Mohms	8.33 x 10^7
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	6.42 x 10^7	Mohms	6.42 x 10^7
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	5.19 x 10^8	Mohms/cm	5.19 x 10^8
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	2.91 x 10^8	Mohms/cm	2.91 x 10^8
CTE(X axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	11	ppm/ºC	11
CTE(Y axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	13	ppm/ºC	13
CTE(Z axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	34	ppm/ºC	34
Density	ASTM D 792	g/cm^3	2.35	g/cm^3	2.35
Hardness	ASTM D 2240(Shore D)		79.1		79.1
Strain at Break(MD)	ASTM D 790/IPC-650 2.4.4	%	0.014	%	0.014
Strain at Break(CD)	ASTM D 790/IPC-650 2.4.4	%	0.013	%	0.013
Specific Heat	ASTM E 1269-05,E 967-08,E968-02	j/(gºC)	0.94	j/(gºC)	0.94
Td(2% Weight Loss)	IPC-650 2.4.24.6/TGA	^oF	788	ºC	420
Td(5% Weight Loss)	IPC-650 2.4.24.6/TGA	^oF	817	ºC	436