| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | CEM-4 |
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| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.002 10GHz |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold plated etc.. |
| PCB SIZE | 152 x 152mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3006 0.254mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 14 mil / 14 mil |
| Minimum / Maximum Holes: | 0.4 mm / 4.0 mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 1 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3006 0.254mm |
| Final foil external: | 1 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1mm |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| RO3006 Typical Value | |||||
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23ºC | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23ºC | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/ºC | 10 GHz -50ºCto 150ºC | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 |
X Y |
MPa | 23ºC | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50ºC | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288ºC) |
17 17 24 |
X Y Z |
ppm/ºC | 23ºC/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ºC TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23ºC | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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