Rogers Printed Circuit Board RO3210 PCB with Enig with 94V0

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ceramic-Filled PTFE Laminate with Woven Fibergla
• Model NO.: BIC-145-V2.0
• Material: Rogers RO3210
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Rogers RO3210
• Insulation Materials: PTFE-Ceramic with Fiberglass
• Model: PCB
• Brand: Rogers
• Final Foil External: 1 Oz
• Final Foil Internal: 1 Oz
• Surface Finish: Immersion Gold
• Final Height of PCB: 0.8 mm ±0.08
• Minimum Trace and Space: 6 Mil / 6 Mil
• Minimum / Maximum Holes: 0.3 mm / 5.6 mm
• Test: 100% Electrical Test Prior Shipment
• Solder Mask Color: Green, Psr-2000gt600d, Taiyo Supplied
• Via: Plated Through Hole(Pth), Minimum Size 0.3mm
• Transport Package: Vacuum
• Specification: 35 x 77 mm=2 designs = 2PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534001000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RF PCB Built on RO3210 25mil 0.635mm DK10.2 With Immersion Gold for Automotive Collision Avoidance Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.

Typical applications:
1. Automotive collision avoidance systems
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellites
6. LMDS and wireless broadband
7. Microstrip patch antennas
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems

PCB Specifications

Rogers RO3210 25mil 0.635mm High Frequency PCB for Automotive Collision Avoidance Systems
PCB SIZE	35 x 77 mm=2 designs = 2PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	RO3210 0.635mm
	copper ------- 18um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	6 mil / 6 mil
Minimum / Maximum Holes:	0.3 mm / 5.6 mm
Number of Different Holes:	2
Number of Drill Holes:	182
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO3210 0.635mm
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	0.8 mm ±0.08
PLATING AND COATING
Surface Finish	Immersion gold (23.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, v-cut
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCB.DOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 3210 (RO3210)

RO3210 Typical Value
Property	RO3210	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.5	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	10.8	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0027	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-459	Z	ppm/ºC	10 GHz 0ºCto 100ºC	IPC-TM-650 2.5.5.5
Dimensional Stability	0.8	X, Y	mm/m	COND A	ASTM D257
Volume Resistivity	10^3		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^3		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	579 517	MD CMD	kpsi	23ºC	ASTM D 638
Water Absorption	<0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
Specific Heat	0.79		j/g/k		Calculated
Thermal Conductivity	0.81		W/M/K	80ºC	ASTM C518
Coefficient of Thermal Expansion (-55 to 288ºC)	13 34	X,Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Td	500		ºC	TGA	ASTM D3850
Density	3		gm/cm^3
Copper Peel Stength	11		pli	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes