6-Layer Rogers RO3003 and Tg170 FR-4 Hybrid PCB with 1.22mm for High-Frequency RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of This High-Performance PCB
This 6-layer rigid PCB combines Rogers RO3003 ceramic-filled PTFE composites and Tg170 FR-4 materials, engineered for high-frequency RF and microwave applications. Rogers RO3003 and Tg170 FR-4 PCB, designed to meet IPC-Class-2 standards, features a compact 82.91mm x 56.61mm board size (±0.15mm tolerance) and a finished thickness of 1.22mm. With advanced construction techniques like blind vias (L1-L2, L1-L3), 5/5 mil trace/space, and immersion gold surface finish, this RO3003 multilayer PCB delivers exceptional signal integrity, thermal stability, and reliability. Its hybrid stackup optimizes performance for automotive radar (77 GHz), 5G infrastructure, and satellite communications.
2. PCB Construction Details (Table)
| Parameter |
Specification |
| Base Material |
RO3003 / Tg170 FR-4 Hybrid Stackup |
| Layer Count |
6 Layers |
| Board Dimensions |
82.91mm x 56.61mm (±0.15mm) |
| Minimum Trace/Space |
5/5 mils |
| Minimum Hole Size |
0.3mm |
| Finished Thickness |
1.22mm |
| Copper Weight (Inner/Outer) |
0.5 oz (Inner) / 1 oz (Outer) |
| Via Plating Thickness |
20μm |
| Surface Finish |
Immersion Gold |
| Solder Mask (Top/Bottom) |
Green |
| Silkscreen |
White (Forbidden on Solder Pads) |
| Impedance Control |
50Ω Single-End (6mil), 100Ω Diff (7/6mil) |
| Electrical Testing |
100% Tested |
3. Additional Components & Features
Key Design Features
This 6-layer Rogers RO3003 and Tg170 FR-4 PCB integrates blind vias (L1-L2/L1-L3) and 5/5 mil trace/space for high-density routing and compact layouts. Precision 50Ω single-ended and 100Ω differential impedance control ensures optimal signal integrity in RF/high-speed designs, while 234 vias enhance connectivity. The hybrid stackup combines Rogers RO3003 core (0.127mm) for high-frequency stability and S1000-2M FR-4 layers (0.36mm) for mechanical rigidity, interleaved with 18μm inner copper layers and 35μm outer copper (Layer 6) to balance signal performance and durability. Prepreg FastRise 28 (0.11mm) ensures reliable interlayer bonding, supporting a finished thickness of 1.22mm. Featuring immersion gold surface finish for corrosion resistance and solderability, it combines green solder masks and white silkscreen (excluded from pads) for durability and clarity.
Component Integration & Layout
Designed for mixed mounting, this multilayer PCB supports 70 components with 116 pads (52 thru-hole, 64 SMT) across layers. The 0.3mm minimum hole size and IPC-Class-2 compliance ensure reliability in harsh environments, enabling compact layouts for automotive radar, 5G infrastructure, and high-frequency systems.
- Material Advantages:
RO3003: Stable Dk (3.0±0.04 @10GHz), ultra-low dissipation factor (0.001), and thermal conductivity (0.5 W/mK).
FR-4 Core: Cost-effective mechanical support with Tg170 for enhanced thermal resistance.
Hybrid Design: Combines RO3003's RF performance with FR-4's durability for multilayer reliability.
Typical Applications:
Automotive radar (77 GHz), ADAS, 5G mmWave infrastructure.
GPS antennas, power amplifiers, patch antennas, and datalink systems.
Why Choose This PCB?
Rogers RO3003 and FR-4 hybrid PCB offers unmatched dielectric stability across temperatures and frequencies, critical for mmWave and RF designs. Its low CTE (17 ppm/°C in-plane) ensures dimensional stability, while the RO3003-FR-4 stackup balances cost and performance. Ideal for high-speed, high-frequency systems requiring precision and reliability.
Tags: RO3003 FR-4 Hybrid PCB, 6-Layer RF Circuit Board, 1.22mm Thickness PCB, Automotive Radar PCB Design, 5G mmWave PCB, Rogers RO3003 High-Frequency PCB, Blind Via PCB Technology, Immersion Gold Surface Finish PCB, IPC-Class-2 Compliant PCB, High-Speed Impedance Control PCB, PTFE Composite PCB, multilayer RF Antenna Board
Order Now for Automotive Radar & 5G Applications!
Upgrade your RF designs with this 6-layer Rogers RO3003 and FR-4 PCB, optimized for GHz-range performance and durability. Submit your Gerber RS-274-X files today for fast global delivery-engineered to meet IPC-Class-2 standards.
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