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| Customization: | Available |
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| Type: | Rigid Laminate |
| Dielectric: | PTFE Glass Fabric Copper-Clad Laminate |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Overview of This Type of Laminate
F4BME is a PTFE glass fabric copper-clad laminate developed by Taizhou Wangling Insulation Material Factory. It shares the same dielectric layer as the F4BM series but is paired with Reverse Treated Foil (RTF) copper. This combination provides excellent Passive Intermodulation (PIM) performance, more precise circuit control, and lower conductor loss, making it suitable for applications with stringent PIM requirements. F4BME255 is the variant with a dielectric constant of 2.55.
Technical Features:
Selectable Dielectric Constant (Dk) from 2.17 to 3.0; customizable Dk.
Low loss (low dissipation factor).
Excellent PIM performance due to Reverse Treated Foil (RTF) copper.
More precise line control and lower conductor loss.
Good dimensional stability and enhanced size control.
Radiation resistance, low outgassing.
Commercialized, high-volume, cost-effective production.
Dimensional stability improves with higher Dk (higher glass content).
UL 94 V-0 flammability rating.
Typical Properties:
| Properties | Test Conditions | Unit | F4BME255 |
|---|---|---|---|
| Electrical Properties | |||
| Dielectric Constant (Typical) | 10 GHz | - | 2.55 |
| Dielectric Constant Tolerance | / | - | ±0.05 |
| Dissipation Factor (Typical) | 10 GHz | - | 0.0013 |
| 20 GHz | - | 0.0018 | |
| Temperature Coefficient of Dk | -55°C to 150°C | ppm/°C | -110 |
| Peel Strength | 1 oz. F4BME | N/mm | >1.6 |
| Volume Resistivity | Normal Condition | MΩ·cm | ≥6×106 |
| Surface Resistance | Normal Condition | MΩ | ≥1×106 |
| Dielectric Strength (Z-direction) | 5 kW, 500 V/s | kV/mm | >25 |
| Breakdown Voltage (XY-direction) | 5 kW, 500 V/s | kV | >34 |
| PIM Performance | Only for F4BME series | dBc | ≤ -159 |
| Thermal & Mechanical Properties | |||
| CTE | XY-direction, -55°C to 288°C | ppm/°C | 16~21 |
| Z-direction, -55°C to 288°C | ppm/°C | 173 | |
| Thermal Stress | 260°C, 10s, 3 cycles | - | No Delamination |
| Water Absorption | 20±2°C, 24 hours | % | ≤0.08 |
| Density | Room Temperature | g/cm³ | 2.25 |
| Long-term Operating Temperature | High/Low Temp Chamber | °C | -55 to +260 |
| Thermal Conductivity | Z-direction | W/(m·K) | 0.33 |
| Flammability Rating | / | UL-94 | V-0 |
| Material Composition | / | / | PTFE, Glass Fiber Cloth; F4BME uses Reverse Treated Foil (RTF) copper. |
Application Areas:
Microwave, RF, Radar
Phase Shifters, Passive Components
Power Dividers, Couplers, Combiners
Feed Networks, Phased Array Antennas
Satellite Communication, Base Station Antennas
Applications requiring excellent PIM performance.
Available Configurations:
Tags: F4BME255, low PIM PCB, RTF copper, PTFE laminate, Dk 2.55, low loss, V-0, thermal stable, RF microwave, antenna applications.
Quality standard: IPC-Class-2
Availability: Worldwide
Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%
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