3-Layer Rt/Duroid 5880 High-Frequency PCB 3.3mm Thick Immersion Gold Finish for Millimeter Wave & Radar Systems

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 5880
• Model NO.: BIC-1413-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Brand: Rogers
• Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

3-Layer RT/duroid 5880 High-Frequency PCB | 3.3mm Thick Immersion Gold Finish for Millimeter Wave & Radar Systems
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Overview of This PCB
This 3-layer high-frequency PCB utilizes Rogers RT/duroid 5880 laminate and RO4450F bondply, engineered for precision stripline and microstrip circuits in millimeter-wave and radar applications. With an ultra-low dielectric constant (Dk = 2.20 ±0.02 @ 10 GHz) and dissipation factor (0.0009 @ 10 GHz), this board ensures minimal signal loss and exceptional electrical uniformity across a wide frequency range. The robust 3.3mm thickness provides mechanical stability, while the immersion gold finish offers superior solderability and corrosion resistance. Certified to IPC-Class-2 standards, this PCB is ideal for high-moisture environments and demanding aerospace/defense systems.



Key benefits include:

Ultra-Low Loss Performance: Lowest electrical loss among reinforced PTFE materials, suitable for Ku-band and beyond.

Dielectric Uniformity: Randomly oriented glass microfibers ensure consistent Dk across the panel and frequency spectrum.

Environmental Resistance: Resistant to solvents, reagents, and moisture (0.02% absorption).

Ease of Fabrication: Easily machined and compatible with standard etching/plating processes.


PCB Construction Details

Parameter	Specification
Base Material	RT/duroid 5880 + RO4450F Bondply
Layer Count	3 Layers
Board Thickness	3.3mm
Copper Weight	1oz (35μm) All Layers
Min. Trace/Space	5 mil / 7 mil
Min. Hole Size	0.4mm
Blind Vias	No
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold (ENIG)
Solder Mask	No (Exposed Copper)
Silkscreen	No
Electrical Test	100% Netlist Test

Design & Manufacturing Specifications
Component Support: 8 components, 29 pads (17 thru-hole, 12 top SMT), 8 vias, and 4 nets.

Artwork Compatibility: Gerber RS-274-X files accepted.

Quality Compliance: IPC-Class-2 certified.


Material Advantages
Isotropic Properties: Uniform electrical behavior in all directions.

Thermal Stability: Low TCDk (-125 ppm/°C) maintains performance across temperature variations.

Chemical Resistance: Withstands harsh etching and plating chemicals.

Low Z-CTE: Reduces risk of plated-through-hole failure in thermal cycling.


Typical Applications
Aerospace Systems: Commercial airline broadband antennas and radar systems.

Millimeter-Wave Devices: Waveguides, filters, and point-to-point radio antennas

Defense Electronics: Guidance systems and surveillance radar.

High-Frequency Circuits: Microstrip/stripline designs for test and measurement equipment.


Why Choose This PCB?
Proven Reliability: Well-established material with decades of use in critical applications.

High-Frequency Precision: 5/7 mil trace/space supports detailed RF layouts.

Global Availability: Prototype and production quantities accessible worldwide.


Order Now for High-Performance Millimeter-Wave PCBs!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers developing cutting-edge radar, aerospace, and telecommunications systems.